Figure 4. 0 Angle Attach Methodology (Top View); Figure 5. 0° Angle Attach Heatsink Modifications - Intel E7500 Thermal Design Manual

Thermal Metrology

Figure 4. 0 Angle Attach Methodology (Top View)

Thermocouple Wire
NOTE: Not to scale.
Figure 5. 0° Angle Attach Heatsink Modifications
NOTE: Not to scale.
18
Substrate
1.3 mm (0.05 in.)
(0.5 mm (0.02 in.) Depth)
3.3 mm (0.13 in.) Diameter
(1.5 mm (0.06 in.) Depth)
®
Intel E7500/E7505 Chipset MCH Thermal Design Guide
Die
Cement +
Thermocouple Bead
angle_attach_1
Angle_Attach_Heatsink_Mod
R