Preparing The Mounting Cutout - Siemens SIMATIC HMI IFP Operating Instructions Manual

Industrial flat panels
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3.1.2.3

Preparing the mounting cutout

Note
Stability of the mounting cutout
The material in the area of the mounting cutout must be sturdy enough to ensure permanent
safe mounting of the device.
To achieve the degrees of protection described below, it must be ensured that deformation
of the material cannot occur due to the force of the mounting clips or operation of the device.
Degrees of protection
The various degrees of protection of the device can only be guaranteed if the following
requirements are met:
● To achieve the degree of protection specified in the technical specifications: Material
thickness at the mounting cut-out: 2 mm to 6 mm
● Permitted deviation from plane at the mounting cutout: ≤ 0.5 mm
This condition must also be met for the installed device.
● Permissible surface roughness in the area of the seal: ≤ 120 µm (R
Dimensions of the mounting cutout
Width and height should be reversed accordingly when mounting in vertical format.
IFP, IFP PRO, IFP ETH
Operating Instructions, 09/2019, A5E31298376-AJ
Installing and connecting the device
3.1 Preparing for installation
120)
z
41

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Simatic hmi ifp proSimatic hmi ifp eth

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