HP Pavilion G4-1010 Maintenance And Service Manual page 84

NOTE:
the system board components each time the heat sink is removed. Replacement thermal material is
included with the base enclosure, heat sink, processor, and system board spare part kits.
●
Thermal paste is used on the processor (1) and the heat sink section (2) that services it
●
A thermal pad is used on the graphics subsystem chip (3) and the heat sink section (4) that
services it (only on computer models equipped with a graphics subsystem with discrete
memory)
1. If it is necessary to replace the fan, turn the fan and heat sink upside down with the fan toward
you.
2. Remove the two Phillips PM2.0×3.0 screws (1) that secure the fan to the heat sink.
3. Disengage the two clips (2) that secure the fan to the heat sink.
4. Remove the heat sink (3) from the fan.
76 Chapter 4 Removal and replacement procedures
The thermal material must be thoroughly cleaned from the surfaces of the heat sink and