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07-2. Precautions for reflow soldering
1) Measure the temperature profile at the mounted connector position, and make sure
that it conforms to the recommended profile.
2) Depending on reflow condition, poor contact may occur by solder and flux
wicking. Please set the reflow conditions that considering the characteristics of
solder and flux. Also please make consideration in setting the reflow times and O
concentration to prevent poor contact by solder and flux wicking.
3) When the molded part of connector melts or becomes deformed during the reflow
process, the heating temperature may be too high, or the connector may be
affected by a nearby electronic component with high heat capacity.
4) When the soldering finish is abnormal, check the next points.
If solder creeps to or near the contact section, then excessive solder may have been
applied or the wicking phenomenon may have occurred. Check the amount of
solder applied, the position, and the temperature profile at the mounted connector
position. In particular, be careful not to apply excessive solder when the N
furnace is used.
5) Extending the screen pattern outward and providing a solder application position
on the outer side can help secure a large front fillet.
Do not open or close the lever or insert the FPC before soldering.
Applying excessive force on the terminals will result in the loosening
of the terminals from the molded portion, or in the faulty coplanarity.
Do not apply solder to the FPC when it is inserted into the connector.
Panasonic Corporation
industrial.panasonic.com/ac/e/
Guide for Getting FPC connector Y5B and Y5BW
Recommended reflow temperature profile
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©
Panasonic Corporation 2015
2
reflow
2
ACCTF15E-3
201507
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