Texas Instruments TRF7970A Manual page 89

RHB0032E
32X (0.6)
1
32X (0.25)
28X (0.5)
( 0.2) TYP
VIA
8
(R0.05)
TYP
0.07 MAX
ALL AROUND
NON SOLDER MASK
NOTES: (continued)
4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature
number SLUA271 (www.ti.com/lit/slua271).
5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown
on this view. It is recommended that vias under paste be filled, plugged or tented.
( 3.45)
SYMM
32
9
LAND PATTERN EXAMPLE
SCALE:18X
METAL
SOLDER MASK
OPENING
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
EXAMPLE BOARD LAYOUT
VQFN - 1 mm max height
25
33
16
(1.475)
(4.8)
0.07 MIN
ALL AROUND
SOLDER MASK
DEFINED
www.ti.com
PLASTIC QUAD FLATPACK - NO LEAD
24
(1.475)
SYMM
(4.8)
17
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
4223442/B 08/2019