Removing The Device; Removing The Built-In Unit; Removing A Pro Device - Siemens SIMATIC HMI Series Operating Instructions Manual

3.6

Removing the device

This section describes how to remove the devices properly, when necessary.
3.6.1

Removing the built-in unit

The built-in device is generally removed in the reverse order for mounting and connecting.
Procedure
Proceed as follows:
1. Switch off the power supply of the built-in device.
2. When you use the built-in device in a hazardous area, make sure that one of the two
following requirements is met: The area is no longer hazardous or the built-in device and
its plug-in connections are de-energized.
3. Remove all cable ties used for strain relief on the strain relief plate of the built-in device.
4. Remove all plug-in connectors and the equipotential-bonding cable from the built-in
device.
5. Remove the screws from the cover of the mounting clip and remove all mounting clips.
6. Remove the built-in device from the cutout.
See also
Installing the built-in unit (Page 45)
Connecting the device (Page 58)
3.6.2

Removing a PRO device

The PRO device is generally removed in the reverse order for mounting and connecting.
Procedure
Proceed as follows:
1. Switch off the power supply of the PRO device.
2. When you use the PRO device in a hazardous area, make sure that one of the two
following requirements is met: The area is no longer hazardous or the PRO device and its
plug-in connections are de-energized.
IFP V2, IFP V2 PRO
Operating Instructions, 08/2019, A5E46641410-AA
Installing and connecting the device
3.6 Removing the device
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