IBM BladeCenter JS12 Problem Determination And Service Manual page 228

v Follow the suggested actions in the order in which they are listed in the Action column until the problem is
solved.
v See Chapter 3, "Parts listing, Type 7998," on page 235 to determine which components are CRUs and which
components are FRUs.
v If an action step is preceded by "(Trained service technician only)," that step must be performed only by a
trained service technician.
Isolation
Symptom
Procedure Code
FSPSP47 The system has
detected an error
within the PSI link.
FSPSP48 A diagnostics
function detects an
external processor
interface problem.
FSPSP49 A diagnostic function
detects an internal
processor interface
problem.
FSPSP50 A diagnostic function
detects a connection
problem between a
processor chip and a
GX chip.
Runtime diagnostics
FSPSP51
has detected a
memory bus
correctable error that
is exceeding
threshold. The
memory bus
correctable error does
not threaten the
system operation at
the moment.
However, the system
is operating under
degraded mode.
FSPSP53 A network error has
occurred between the
Service Processor and
the network switch.
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JS12 Type 7998: Problem Determination and Service Guide
Action
Replace the system board and chassis assembly, as described in
"Replacing the Tier 2 system-board and chassis assembly" on page 274.
If the CRUs called out before this procedure do not fix the problem,
contact IBM Support.
If the CRUs called out before this procedure do not fix the problem,
contact IBM Support.
If the CRUs called out before this procedure do not fix the problem,
contact IBM Support.
Replace the CRU called out after this FSPSP call. If the CRU that is
called out is a DIMM CRU, perform the following procedure:
1. Replace both memory DIMMs of the pair on the microprocessor that
contains the failing CRU:
DIMM 1 (P1-C4)
Replace DIMMS 1 and 2.
DIMM 2 (P1-C3)
Replace DIMMS 1 and 2.
DIMM 3 (P1-C1)
Replace DIMMS 3 and 4.
DIMM 4 (P1-C2)
Replace DIMMS 3 and 4.
2. See "Removing a memory module" on page 251 for location
information and the removal procedure.
3. Install new memory DIMMs, as described in "Installing a memory
module" on page 251.
See "Supported DIMMs" on page 4 for more information.
Replace the system board and chassis assembly, as described in
"Replacing the Tier 2 system-board and chassis assembly" on page 274.