Pressure Specification - AMD SP5100 Data Book

44409 Rev. 1.70 October 10
12.2

Pressure Specification

To avoid damages to the ASIC (die or solder ball joint cracks) caused by improper mechanical assembly
of the cooling device, follow the recommendations below:

It is recommended that the maximum load that is evenly applied across the contact area between the
thermal management device and the die does not exceed 6 lbf. Note that a total load of 4-6 lbf is
adequate to secure the thermal management device and achieve the lowest thermal contact
resistance with a temperature drop across the thermal interface material of no more than 3°C. Also,
the surface flatness of the metal spreader should be 0.001 inch/1 inch.

Pre-test the assembly fixture with a strain gauge to make sure that the flexing of the final assembled
board and the pressure applying around the ASIC package will not exceed 600 micron strain under
any circumstances.

Ensure that any distortion (bow or twist) of the board after SMT and cooling device assembly is within
industry guidelines (IPC/EIA J-STD-001). For measurement method, refer to the industry approved
technique described in the manual IPC-TM-650, section 2.4.22.
Package Information
AMD SP5100 Databook
75