Note For Printed Wiring Board And Schematic Diagrams - Sony MZ-B10 Service Manual

MZ-B10
6-2.

Note For Printed Wiring Board And Schematic Diagrams

Note on Printed Wiring Board:
• X : parts extracted from the component side.
• Y : parts extracted from the conductor side.
• : Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
Caution:
Pattern face side: Parts on the pattern face side seen from
(Side B) the pattern face are indicated.
Parts face side: Parts on the parts face side seen from
(Side A) the parts face are indicated.
• MAIN board is four-layer printed board.
However, the patterns of layers 2 and 3 have not been
included in this diagrams.
* Replacement of IC501,IC801 on MAIN board requires a
special tool.
• Lead Layouts surface
Lead layout of conventional IC CSP (chip size package)
Note on Schematic Diagram:
• All capacitors are in µF unless otherwise noted. pF: µµF
50 WV or less are not indicated except for electrolytics
and tantalums.
• All resistors are in Ω and
1 / W or less unless otherwise
4
specified.
• % : indicates tolerance.
• C : panel designation.
Note: The components identified by mark 0 or dotted line
with mark 0 are critical for safety.
Replace only with part number specified.
• A : B+ Line.
• Total current is measured with MD installed.
• Power voltage is dc 3 V and fed with regulated dc power
supply from DC IN 3 V jack (J601).
• Voltages and waveforms are dc with respect to ground in
playback mode.
no mark : PLAYBACK
( ) : REC
∗
: Impossible to measure
• Voltages are taken with a VOM (Input impedance 10 MΩ).
Voltage variations may be noted due to normal produc-
tion tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal produc-
tion tolerances.
• Circled numbers refer to waveforms.
• Signal path.
J
: PLAYBACK
c : DIGITAL IN
F
: ANALOG IN
f
: RECORD
• The voltage and waveform of CSP (chip size package)
cannot be measured, because its lead layout is different
form that of conventional IC.
* Replacement of IC501,IC801 on MAIN board requires a
special tool.
• Waveforms
1 4
IC501 9 (RFO)(TP1517) IC601 4 (CLK)
1.1Vp-p
500mV/DIV, 200ns/DIV 1V/DIV, 2µs/DIV
2 5
IC501 rd (TE)(SL501) IC801 2 (OSCO)
(at the point of R805)
730mVp-p
500mV/DIV, 1ms/DIV 500mV/DIV, 20ns/DIV
3 6
IC501 rs (FE)(SL502) IC901 yd (CLK)
270mVp-p
200mV/DIV, 1ms/DIV
1V/DIV, 2µs/DIV
36 36
7
IC301 9 (MCLK)
2.5Vp-p
5.67µs
88.6ns
2.7Vp-p
1V/DIV, 40ns/DIV
8
IC301 8 (BCLK)
(REC mode)
44.3ns 2.6Vp-p
1.5Vp-p
354ns
1V/DIV, 100ns/DIV
9
IC301 q; (LRCK)
2.5Vp-p
(REC mode)
22.7µs 2.4Vp-p
5.67µs
1V/DIV, 10µs/DIV