Note For Printed Wiring Board And Schematic Diagrams - Sony MZ-NF810CK Service Manual

MZ-NF810/NF810CK
6-2.

Note For Printed Wiring Board And Schematic Diagrams

Note on Printed Wiring Board:
• X : parts extracted from the component side.
• Y : parts extracted from the conductor side.
• : Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
Caution:
Pattern face side: Parts on the pattern face side seen from
(Conductor Side) the pattern face are indicated.
Parts face side: Parts on the parts face side seen from
(Component Side) the parts face are indicated.
• MAIN board is four-layer printed board.
However, the patterns of layers 2 and 3 have not been
included in this diagrams.
* Replacement of IC501,IC801 on MAIN board requires a
special tool.
• Lead Layouts surface
Lead layout of conventional IC CSP (chip size package)
When IC851 is damaged, replace the MAIN board.
Note on Schematic Diagram:
• All capacitors are in µF unless otherwise noted. pF: µµF
50 WV or less are not indicated except for electrolytics
and tantalums.
• All resistors are in Ω and
1 / W or less unless otherwise
4
specified.
• % : indicates tolerance.
• : internal component.
f
• C : panel designation.
Note: Note:
The components identified by Les composants identifiés par
mark 0 or dotted line with mark une marque 0 sont critiques
0 are critical for safety.
pour la sécurité.
Replace only with part number Ne les remplacer que par une
specified. pièce portant le numéro spécifié.
• A : B+ Line.
• Total current is measured with MD installed.
• Power voltage is dc 3 V and fed with regulated dc power
supply from DC IN 3 V jack (J951).
• Voltages and waveforms are dc with respect to ground in
playback mode.
no mark : PLAYBACK
( ) : REC
∗
: Impossible to measure
• Voltages are taken with a VOM (Input impedance 10 MΩ).
Voltage variations may be noted due to normal produc-
tion tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal produc-
tion tolerances.
• Circled numbers refer to waveforms.
• Signal path.
J
: PLAYBACK
c : DIGITAL IN
F
: ANALOG IN
f : RECORD
N : USB
• The voltage and waveform of CSP (chip size package)
cannot be measured, because its lead layout is different
form that of conventional IC.
* Replacement of IC501,IC801 on MAIN board requires a
special tool.
When IC851 is damaged, replace the MAIN board.
• Abbreviation
3CED : Spanish, Swedish, Portuguese and Finnish model
4CED : French, German, Dutch and Italian model
• Waveforms
1 4
IC501 9 (RFO)(TP1517) IC601 4 (CLK)
1.2Vp-p
1V/DIV, 2 µ s/DIV
500mV/DIV, 200ns/DIV
2 5
IC501 rd (TE)(SL501) IC801 2 (OSCO)
(at the point of R806)
780mVp-p
44.3ns
500mV/DIV, 1ms/DIV 500mV/DIV, 20ns/DIV
3 6
IC501 rs (FE)(SL502) IC801 <z,/ (UOSCO)
(USB mode)
(at the point of R823)
240mVp-p
20.8ns
200mV/DIV, 1ms/DIV 1V/DIV, 10ns/DIV
38 38
7 0
IC901 yd (CLK) IC301 q; (LRCK)
2.4Vp-p 2.4Vp-p
(REC mode)
22.7 µ s
5.67 µ s 5.67 µ s
1V/DIV, 2 µ s/DIV 1V/DIV, 10 µ s/DIV
8
IC301 9 (MCLK)
2Vp-p
88.6ns
2.6Vp-p
1V/DIV, 40ns/DIV
9
IC301 8 (BCLK)
(REC mode)
2.6Vp-p
354ns
3.2Vp-p
1V/DIV, 100ns/DIV
2.4Vp-p