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6-3.
NOTE FOR PRINTED WIRING BOARD AND SCHEMATIC DIAGRAMS
Note on Printed Wiring Board:
• X : parts extracted from the component side.
• Y : parts extracted from the conductor side.
•
: internal component.
f
•
: Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
Caution:
Pattern face side:
Parts on the pattern face side seen from
(Conductor Side)
the pattern face are indicated.
Parts face side:
Parts on the parts face side seen from
(Component Side) the parts face are indicated.
• MAIN board is multi-layer printed board.
However, the patterns of intermediate layers have not
been included in this diagrams.
∗ Replacement of IC501 and IC801 used in this set re-
quires a special tool.
surface
• Lead Layouts
Lead layout of conventional IC
CSP (chip size package)
Note on Schematic Diagram:
• All capacitors are in µF unless otherwise noted. pF: µµF
50 WV or less are not indicated except for electrolytics
and tantalums.
• All resistors are in Ω and
1
/
W or less unless otherwise
4
specified.
•
: internal component.
f
• C : panel designation.
Note: The components identified by mark 0 or dotted line
with mark 0 are critical for safety.
Replace only with part number specified.
• A : B+ Line.
• Total current is measured with MD installed.
• Power voltage is dc 3 V and fed with regulated dc power
supply from DC IN 3 V jack (JK951).
• Voltages and waveforms are dc with respect to ground in
playback mode.
no mark : PLAYBACK
(
) : REC
〈〈
〉〉 : USB
∗
: Impossible to measure
• Voltages are taken with a VOM (Input impedance 10 MΩ).
Voltage variations may be noted due to normal produc-
tion tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal produc-
tion tolerances.
• Circled numbers refer to waveforms.
• Signal path.
J
: PLAYBACK
f
: REC
F
: USB
• Abbreviation
HK
: Hong Kong model
∗ Replacement of IC501 and IC801 used in this set re-
quires a special tool.
• The voltage and waveform of CSP (chip size package)
cannot be measured, because its lead layout is different
form that of conventional IC.
• Waveforms
1 IC501 9 (RFO)
1.2 Vp-p
2 IC501 wh (CLK)
3.1 Vp-p
88 ns
3 IC501 rs (FE)
Approx.
350 mVp-p
4 IC501 rd (TE)
Approx.
400 mVp-p
5 IC801 2 (OSCO)
2.1 Vp-p
44.6 µs
39
39
6 IC801 ef (CLK)
2.3 Vp-p
5.7 µs
7 IC801 <z,/> (UOSCO) (USB mode)
2.7 Vp-p
21 ns
8 IC651 5 (EXT) (USB mode)
3.3 Vp-p
9.8 µs
9 Q653 (Base) (USB mode)
0.7 Vp-p
9.8 µs
AM-NX1
Ver 1.1
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