Preparation For Mounting - Siemens Simatic MP 377 Operating Instructions Manual

Planning application

3.3 Preparation for mounting

3.3 Preparation for mounting
Selecting the mounting location for the HMI device
Points to observe when selecting the mounting location:
● Position the HMI device so that it is not subjected to direct sunlight.
● Position the HMI device such that it is ergonomically accessible for the user.
● Make sure that you do not cover the fan and the air vents of the HMI device during
Ensuring degree of protection
The degree of protection according to the information in the chapter "Technical
Specifications (Page 54)" can only be ensured if the HMI device is installed with the supplied
mounting clamps. Additional fastening bore holes or threaded bolts are not required for the
mounting cutout.
The front material has to consist of sheet steel or material of a strength that corresponds to
at least the stability of sheet steel.
Mounting cutout
The following conditions apply to the mounting cutout:
Mounting cutout
Material thickness with IP66 degree of protection
Material thickness with enclosure type 4X/type 12 (indoor use only)
Permitted deviation from plane
This condition must be fulfilled for the mounted HMI device.
Permitted surface roughness in the area of the mounting seal
The following table shows the dimensions of the mounting cutout:
Dimensions
Width
Height
Depth
26
The display was designed for operation in direct sunlight.
Choose a suitable mounting height and mounting angle.
installation.
HMI device
367
289
105.5 mm
mm
+1
mm
+1
Operating Instructions (Compact), 04/2009, A5E02532357-01
Dimensions
1.5 to 5 mm
3 to 5 mm
≤ 0.5 mm
≤ 120 µm (R
MP 377 15" Touch daylight readable (WinCC flexible)
120)
z