IBM eServer xSeries 226 Type 8648 Option Installation Manual page 39

a. Press down on the blue touch point of the heat-sink release lever, then lift
the lever up as far as it will go (135°) to release the baffle assembly.
b. Grasp the front of the baffle assembly and tip it up toward the rear of the
server while pulling the rear flange out of the heat-sink retention module;
then, lift the baffle assembly up and out of the server.
Attention: When you handle static-sensitive devices, take precautions to
avoid damage from static electricity. For details about handling these devices,
see "Handling static-sensitive devices" on page 8.
7. If the second microprocessor socket is covered with protective film or a label,
peel and remove the film or label.
8. Install the microprocessor:
a. Touch the static-protective package containing the new microprocessor to
any unpainted metal surface on the server; then, remove the
microprocessor from the package.
b. Pull out and lift up on the microprocessor-release lever to unlock the
microprocessor socket.
Attention:
1) Do not use excessive force when pressing the microprocessor into the
socket.
2) Make sure that the microprocessor is oriented and aligned correctly
with pin number 1 in the socket before you try to close the
microprocessor-release lever. The following illustration shows the
alignment marks for both microprocessors and sockets.
Microprocessor 1
Microprocessor 2
Microprocessor
socket 1
Retention bracket
springs
Microprocessor
socket 2
c. Center the microprocessor over the microprocessor socket. Align the
triangle on the corner of the microprocessor with the triangle on the corner
of the socket and carefully press the microprocessor into the socket.
d. Carefully close the microprocessor-release lever to secure the
microprocessor in the socket.
Alignment marks
Heat-sink
release levers
Microprocessor-
release levers
Chapter 2. Installing options
27