Reliability; Thermal Considerations For Components - Intel BOXD915GEV - LGA775 800FSB 4DDR2 Aud+Vdo SATA ATX 4PCI Manual

Intel Desktop Board D915GEV/D915GRF Technical Product Specification
Table 37 provides maximum case temperatures for the Desktop Board D915GEV/D915GRF
components that are sensitive to thermal changes. The operating temperature, current load, or
operating frequency could affect case temperatures. Maximum case temperatures are important
when considering proper airflow to cool the Desktop Board D915GEV/D915GRF.
Table 37.

Thermal Considerations for Components

Component
Intel Pentium 4 processor
Intel 82915G GMCH
Intel 82801FB ICH6
For information about
Intel Pentium 4 processor datasheets and specification updates

2.13 Reliability

The Mean Time Between Failures (MTBF) prediction is calculated using component and
subassembly random failure rates. The calculation is based on the Bellcore Reliability Prediction
Procedure, TR-NWT-000332, Issue 4, September 1991. The MTBF prediction is used to estimate
repair rates and spare parts requirements.
The MTBF data is calculated from predicted data at 55 ºC. The MTBF for the D915GEV and
D915GRF boards is 110,262 hours.
78
Maximum Case Temperature
For processor case temperature, see processor datasheets and
processor specification updates
o
99 C (under bias)
o
110 C (under bias)
Refer to
Section 1.3, page 17