Reliability; Thermal Considerations For Components - Intel D975XBX Technical Product Specification

Table 36 provides maximum case temperatures for the components that are sensitive to thermal
changes. The operating temperature, current load, or operating frequency could affect case
temperatures. Maximum case temperatures are important when considering proper airflow to cool
the board.
Table 36.

Thermal Considerations for Components

Component
Intel 82801G ICH7-R/ICH7-DH
Intel 82975X MCH
Intel Pentium 4 processor
Processor voltage regulator area
NOTE
For hardware monitoring application software, an alert point of 110
starting point for the processor voltage regulator area.
For information about
Intel Pentium 4 processor datasheets and specification updates

2.12 Reliability

The Mean Time Between Failures (MTBF) prediction is calculated using component and
subassembly random failure rates. The calculation is based on the Bellcore Reliability Prediction
Procedure, TR-NWT-000332, Issue 4, September 1991. The MTBF prediction is used to estimate
repair rates and spare parts requirements.
The MTBF data is calculated from predicted data at 55 ºC. The MTBF for the board is 99,721
hours.
Temperature
o
110 C (under bias)
o
99 C (under bias)
For processor case temperature, see processor datasheets and
processor specification updates
o
120 C (under bias)
Technical Reference
o
C is recommended as a
Refer to
Section 1.2, page 15
77