Thermal Considerations; Processor Heatsink Airflow - Intel BOXD915GEV - LGA775 800FSB 4DDR2 Aud+Vdo SATA ATX 4PCI Manual

Intel Desktop Board D915GEV/D915GRF Technical Product Specification

2.12 Thermal Considerations

CAUTION
A chassis with a maximum internal ambient temperature of 38
requirement. Use a processor heatsink that provides omni-directional airflow (as shown in
Figure 24) to maintain required airflow across the processor voltage regulator area.
CAUTION
Failure to ensure appropriate airflow may result in reduced performance of both the processor
and/or voltage regulator or, in some instances, damage to the board. For a list of chassis that
have been tested with Intel desktop boards please refer to the following website:
http://developer.intel.com/design/motherbd/cooling.htm
All responsibility for determining the adequacy of any thermal or system design remains solely
with the reader. Intel makes no warranties or representations that merely following the
instructions presented in this document will result in a system with adequate thermal performance.
CAUTION
Ensure that the ambient temperature does not exceed the board's maximum operating temperature.
Failure to do so could cause components to exceed their maximum case temperature and
malfunction. For information about the maximum operating temperature, see the environmental
specifications in Section 2.14.
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Figure 24. Processor Heatsink Airflow
o
C at the processor fan inlet is a
OM16996