Reliability; Environmental; Environmental Specifications - Intel DH61BF Technical Product Specification

2.7

Reliability

The Mean Time Between Failures (MTBF) prediction is calculated using a parts count
method. The calculation is based on the Telcordia SR-332, Method I Case 1 50%
electrical stress, 55 ºC ambient. The MTBF prediction is used to estimate repair rates
and spare parts requirements. The MTBF data is calculated from predicted data at
55 ºC. The MTBF for the board is 70,677 hours.
2.8

Environmental

Table 25 lists the environmental specifications for the board.
Table 25. Environmental Specifications
Parameter
Temperature
Non-Operating
Operating
Shock
Unpackaged
Packaged
Vibration
Unpackaged
Packaged
Note: Before attempting to operate this board, the overall temperature of the board must be above the
minimum operating temperature specified. It is recommended that the board temperature be at least
room temperature before attempting to power on the board.
Specification
(Note)
-40 °C to +60 °C
0 °C to +50 °C
The operating temperature of the board may be determined by measuring the
air temperature from within 1 inch of the edge of the chipset/PCH heatsink and
1 inch above the board, in a closed chassis, while the system is in operation.
50 g trapezoidal waveform
Velocity change of 170 inches/second²
Half sine 2 millisecond
Product Weight (pounds)
<20
21-40
41-80
81-100
5 Hz to 20 Hz: 0.01 g² Hz sloping up to 0.02 g² Hz
20 Hz to 500 Hz: 0.02 g² Hz (flat)
5 Hz to 40 Hz: 0.015 g² Hz (flat)
40 Hz to 500 Hz: 0.015 g² Hz sloping down to 0.00015 g² Hz
Free Fall (inches) Velocity Change (inches/sec²)
36 167
30 152
24 136
18 118
Technical Reference
53