Thermal Considerations - Intel BOXD845GLVAL - 845GL CEL/P4 400MHZ FSB UATX Specification

Desktop board technical product specification
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The power supply must comply with the following recommendations found in the indicated sections
of the ATX form factor specification.
The potential relation between 3.3 VDC and +5 VDC power rails (Section 4.2)
The current capability of the +5 VSB line (Section 4.2.1.2)
All timing parameters (Section 4.2.1.3)
All voltage tolerances (Section 4.2.2)

2.12 Thermal Considerations

CAUTION
Ensure that the ambient temperature does not exceed the Desktop Board's maximum operating
temperature. Failure to do so could cause components to exceed their maximum case temperature
and malfunction. For information about the maximum operating temperature, see the
environmental specifications in Section 2.14.
CAUTION
Ensure that proper airflow is maintained in the processor voltage regulator circuit. Failure to do
so may result in damage to the voltage regulator circuit. The processor voltage regulator area
(item A in Figure 13) can reach a temperature of up to 85
Technical Reference
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C in an open chassis.
65

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