2.12 Reliability; Thermal Considerations For Components - Intel BLKD945GCCR Specification

Intel Desktop Board D945GCCR Technical Product Specification
Table 30 provides maximum case temperatures for the components that are sensitive
to thermal changes. The operating temperature, current load, or operating frequency
could affect case temperatures. Maximum case temperatures are important when
considering proper airflow to cool the board.
Table 30. Thermal Considerations for Components
Component
Processor
Intel 82945GC GMCH
Intel 82801GB ICH7
For information about
Processor datasheets and specification updates

2.12 Reliability

The Mean Time Between Failures (MTBF) prediction is calculated using component and
subassembly random failure rates. The calculation is based on the Bellcore Reliability
Prediction Procedure, TR-NWT-000332, Issue 4, September 1991. The MTBF
prediction is used to estimate repair rates and spare parts requirements.
The MTBF data is calculated from predicted data at 55 ºC. The MTBF for the
D945GCCR board is 152,352 hours.
66
Maximum Case Temperature
For processor case temperature, see processor datasheets and
processor specification updates
o
99 C (under bias)
o
110 C (under bias, without heatsink)
99 o C (under bias, with heatsink)
Refer to
Section 1.2, page 15