Reliability; Thermal Considerations For Components - Intel D815EEA2 Technical Product Specification

Table 56 provides maximum case temperatures for D815EEA2 and D815EPEA2 board components
that are sensitive to thermal changes. Case temperatures could be affected by the operating
temperature, current load, or operating frequency. Maximum case temperatures are important when
considering proper airflow to cool the D815EEA2 and D815EPEA2 boards.
Table 56.

Thermal Considerations for Components

Component
Intel Pentium III processor
Intel Celeron processor
Intel 82815 GMCH/
Intel 82815EP MCH
Intel 82801BA ICH2
For information about
Intel Pentium III processor datasheets and specification updates
Intel Celeron processor datasheets and specification updates

2.13 Reliability

The mean time between failures (MTBF) prediction is calculated using component and
subassembly random failure rates. The calculation is based on the Bellcore Reliability Prediction
Procedure, TR-NWT-000332, Issue 4, September 1991. The MTBF prediction is used to estimate
repair rates and spare parts requirements.
The Mean Time Between Failures (MTBF) data is calculated from predicted data at 35 ºC.
D815EEA2 and D815EPEA2 boards' MTBF: 355,748 hours.
Maximum Case Temperature
For processor case temperature, see processor datasheets and processor
specification updates
o
116 C (under bias)
o
109 C (under bias)
Technical Reference
Refer to
Section 1.3, page 19
Section 1.3, page 19
97