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Item Description | Notes | Quantity of items included in product |
Printed Circuit Boards (PCB) or Printed Circuit Assemblies (PCA) | With a surface greater than 10 sq cm IF BD, POWER BD, FK BD | 3 |
Batteries | All types including standard alkaline and lithium coin or button style batteries | 0 |
Mercury-containing components | For example, mercury in lamps, display backlights, scanner lamps, switches, batteries | 0 |
Liquid Crystal Displays (LCD) with a surface greater than 100 sq cm | Includes background illuminated displays with gas discharge lamps Panel | 1 |
Cathode Ray Tubes (CRT) | 0 | |
Capacitors / condensers (Containing PCB/PCT) | 0 | |
Electrolytic Capacitors / Condensers measuring greater than 2.5 cm in diameter or height | Power BD only (C805) | 1 |
External electrical cables and cords | USB cable, D-sub cable, Power cord | 3 |
Gas Discharge Lamps | 0 | |
Plastics containing Brominated Flame Retardants | 0 | |
Components and parts containing toner and ink, including liquids, semi-liquids (gel/paste) and toner | Include the cartridges, print heads, tubes, vent chambers, and service stations. | 0 |
Components and waste containing asbestos | 0 | |
Components, parts and materials containing refractory ceramic fibers | 0 | |
Components, parts and materials containing radioactive substances | 0 |
List the type and size of the tools that would typically be used to disassemble the product to a point where components and materials requiring selective treatment can be removed.
Tool Description | Tool Size (if applicable) |
Description #1 SCREW DRIVER(PHILLIPS HEAD) | #2 |
Description #2SCREW DRIVER(PHILLIPS HEAD) | #1 |
Description #3SCREW DRIVER(PHILLIPS HEAD) | #0 |
Description #4SCREW DRIVER(HEX HEAD) | SPECIAL |
Description #5 |
List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items contained in the product that require selective treatment (with descriptions and arrows identifying locations).
HP E241i Disassembly Process
Take Screw(*4) Off and remove Stand Base From Display Head
Remove Rear Cover From Display Head
Remove Rubber From Rear Cover
Take Screw(*14) Off From P.C.B & Remove Chassis cover
Remove Gasket From Chassis Cover
Take Screw(*3) Off From Front Cover & Remove Function Key P.C.B
Remove HP logo and OSD & power Button From Front Cover
Take Screw(*4) Off and Remove VESA BRKT From Stand
Remove VESA POM and Sharks lift cover from Stand
Remove Tilt Cover ( left and right )from Stand
Remove Base Cover & Space Swivel Cover From Stand Base BKT
Dissecting to complete.
Here you can download full pdf version of manual, it may contain additional safety instructions, warranty information, FCC rules, etc.
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