Summary of Contents for Infineon CUR SENSOR PROG GEN2
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About this document Scope and purpose This document describes the hardware and software functionalities of the Infineon CUR SENSOR PROG GEN2 package, named generically in this document as “TLE4973 bootkit”. The TLE4973 bootkit is a utility package specially designed for interfacing TLE4973 evaluation kits (three- phase) or a stand-alone XENSIV TLE4973 Hall current sensor (single-phase).
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Infineon Technologies. The design of the Evaluation Boards and Reference Boards has been tested by Infineon Technologies only as described in this document. The design is not qualified in terms of safety requirements, manufacturing and operation over the entire operating temperature range or lifetime.
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The customer assumes all responsibility and liability for the correct handling and/or use of the TLE4973 bootkit. The customer undertakes to indemnify and hold the Infineon Technologies harmless from any third-party claim in connection with or arising out of the use and/or handling of the TLE4973 bootkit.
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TLE4973 current sensor bootkit programmer User guide Table of contents Table of contents About this document ..............1 Important notice .
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TLE4973 current sensor bootkit programmer User guide 1 Introduction Introduction The TLE4973 bootkit is a medium-priced evaluation kit that enables the possibility to evaluate the behavior and performance of the XENSIV TLE4973 Hall current sensor, a high-precision miniature coreless magnetic ™...
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20-pin ribbon cable, for connecting the current sensor programmer shield to a TLE4973 evaluation board • 2 × micro USB cable The evaluation hardware can be ordered only via the Infineon sales channels. The required order numbers are listed in Table...
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TLE4973 current sensor bootkit programmer User guide 2 Getting started Hardware design This chapter offers a detailed hardware design description of the TLE4973 bootkit evaluation kit. The latest revision of this evaluation kit is V2.0. The evaluation kit is composed of two PCBs connected via headers: •...
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TLE4973 current sensor bootkit programmer User guide 2 Getting started User guide Rev. 2.00 2025-05-15...
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TLE4973 current sensor bootkit programmer User guide 2 Getting started 2.2.2 Current sensor programmer shield PCB design The hardware design is physically implemented in the PCB technology, using a standard process with the following technical characteristics: • PCB material: FR4 •...
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TLE4973 current sensor bootkit programmer User guide 2 Getting started Figure 5 Current sensor programmer shield PCB (bottom layer) User guide Rev. 2.00 2025-05-15...
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TLE4973 current sensor bootkit programmer User guide 2 Getting started 2.2.3 Bill of materials Table 3 Current sensor programmer shield board assembly bill of materials Parts Value Device Package/footprint Description X1, X2, X3, X4, X5, testpad_1.50 mm testpad_1.50 mm testpad_1.50 mm testpad_1.50 mm X6, X7, X8, X9 R10, R11, R12, R13...
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Current Sensor or TLE4973 and the following record shall appear: XENSIV TLx4973 ™ Current Sensor Programmer App. Figure 6 Infineon development center – online tools filtering Note: • It is highly advised to install the Infineon Developer Center Launcher application prior to installing the evaluation kit software.
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.NET 4.8 online installer (needed only for the older versions of Windows which do not have this already installed). Installation requires stable internet connection Installation steps • License agreement: It is required that you agree with the Infineon terms and conditions before continuing. After accepting, press Next. Figure 7 Software installation step – license agreement •...
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TLE4973 current sensor bootkit programmer User guide 2 Getting started Figure 8 Software installation step – quick installation • SEGGER J-LINK drivers: Once the binaries are copied to the installation folder, the user is prompted for installing SEGGER J-LINK drivers. If the user has already installed a newer version on the computer, no changes will be made.
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TLE4973 current sensor bootkit programmer User guide 2 Getting started Figure 9 Software installation step – SEGGER J-LINK drivers installation • .NET Framework 4.8: Once the SEGGER J-LINK drivers are installed or the operation is canceled, the user is prompted for installing .NET Framework 4.8. Note: For operating systems starting from Windows 10, build 1903, this version has already been pre-installed with .NET Framework 4.8 and the user is notified that the required package is...
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TLE4973 current sensor bootkit programmer User guide 2 Getting started Figure 10 Software installation step – .NET 4.8 installation • Finishing the installation: The user is notified upon the completion of all the installer processes and a shortcut is, by default, created on the Desktop. The user may opt to Open release notes (to check the latest updates) or to run the installed XENSIV TLx4973 Current Sensor Programmer App.
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TLE4973 current sensor bootkit programmer User guide 2 Getting started Figure 11 Software installation step – completion User guide Rev. 2.00 2025-05-15...
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To uninstall the software package, go to Start, select Add or remove programs, and then search for TLx4973, as Current Sensor is a generic keyword for multiple Infineon evaluation software applications. Press Uninstall to delete the software from your PC.
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TLE4973 current sensor bootkit programmer User guide 3 Using the evaluation software Using the evaluation software This chapter describes all features of the XENSIV TLx4973 Current Sensor Programmer App and the usage, ™ in correlation with the TLE4973 bootkit. Make sure that the XMC1100 board is connected to your PC via micro- USB cable and a TLE4973 current sensor/evaluation kit is connected to the shield before proceeding with the next steps.
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TLE4973 current sensor bootkit programmer User guide 3 Using the evaluation software Figure 14 Software usage – startup screen Toolbar At the top of the window, the toolbar provides multiple buttons, allowing the user to monitor and configure the TLE4973 bootkit, the software application, and the associated TLE4973 evaluation kits: •...
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TLE4973 current sensor bootkit programmer User guide 3 Using the evaluation software Note: For more information about the process involved in calculating this transfer factor, refer to the TLE4973 current sensor user manual. Figure 15 Toolbar – board transfer factor 3.2.2 Temperature readout The temperature of each individual sensor on a TLE4973 evaluation kit or of a standalone TLE4973 current...
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TLE4973 current sensor bootkit programmer User guide 3 Using the evaluation software 3.2.3 Register readout Independent register values can be read from all the three sensors on a TLE4973 evaluation kit or a standalone TLE4973 current sensor, in LSB format, using a similar interface to the temperature readout graph. For more details regarding the configurable bit fields and binary representation of the internal registers, refer to the EEPROM map or the TLE4973 current sensor user manual.
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TLE4973 current sensor bootkit programmer User guide 3 Using the evaluation software 3.2.5 EEPROM map The EEPROM Mapping window displays the content of the internal registers in binary format, alongside a brief description of the bit fields, as described in the TLE4973 current sensor user manual. Selecting an address from the menu displays all the corresponding bit fields, with their respective name on the left and the decimal/ hexadecimal values on the right side of the window.
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TLE4973 current sensor bootkit programmer User guide 3 Using the evaluation software 3.2.6 Basic configuration The most common measurement settings can be configured in this window, using the provided drop-down menus and the manual input text boxes. The Sensor Select drop-down menu switches between the three independent sensors on a TLE4973 evaluation kit and performs an EEPROM read when modified.
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TLE4973 current sensor bootkit programmer User guide 3 Using the evaluation software Figure 21 Toolbar – EEPROM map 3.2.8 Current rail transfer factor As described in Board transfer factor, the transfer factor is a vital component in calculating the value of the current.
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TLE4973 current sensor bootkit programmer User guide 3 Using the evaluation software The Get Diagnostic checkbox enables the direct monitoring of the OCD line, saturation information, and temperature of each sensor. The graphs are initially scaled to 5 A/div, but the scale can be manually changed up to 100 A/div, each graph independently or all three at once, selectable from the Apply to all checkbox.
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TLE4973 current sensor bootkit programmer User guide 3 Using the evaluation software methods consists in whether the voltage measurements are performed by the XMC1100 microcontroller or by the user. Figure 24 Automatic (left) and manual (right) double code word calibration 3.4.1 Automatic double code word calibration •...
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TLE4973 current sensor bootkit programmer User guide 3 Using the evaluation software • Upon pressing the Start Procedure button, a series of pop-up instructions will appear, instructing the user to connect or disconnect the current source from the sensor • At the end of the process, the new g_base and o_base values will be checked automatically by the application for validity, requiring the user to press the Burn EEPROM button to save the changes.
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TLE4973 current sensor bootkit programmer User guide 3 Using the evaluation software Figure 26 Fine tuning calibration User guide Rev. 2.00 2025-05-15...
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TLE4973 current sensor bootkit programmer User guide 3 Using the evaluation software The calibration data of the connected sensor is shown at the top of the window. The programmed measurement range in decimal values is extracted from the device EEPROM and the corresponding sensitivity [mV/mT] and offset correction resolution [mV/LSB] are reported.
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TLE4973 current sensor bootkit programmer User guide Revision history Revision history Document Date Description of changes revision 1.00 2025-04-08 Initial release 2.00 2025-05-15 Hardware V2.0 introduction User guide Rev. 2.00 2025-05-15...
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Infineon Technologies, All Rights Reserved. of any kind, including without limitation warranties of Infineon Technologies’ products may not be used in non-infringement of intellectual property rights of any any applications where a failure of the product or third party.
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