Download
Share
Print this page
Quectel EC800M Series Manual
  1. Manuals
  2. Brands
  3. Quectel Manuals
  4. Control Unit
  5. EC800M Series
  6. Manual
Quectel EC800M Series Manual

Quectel EC800M Series Manual

Quecopen hardware design
Hide thumbs

Advertisement

Quick Links

Download this manual
EC800M-CN
Hardware Design
LTE Standard Module Series
Version: 1.1
Date: 2023-07-28
Status: Released
QuecOpen

Advertisement

loading
Need help?

Need help?

Do you have a question about the EC800M Series and is the answer not in the manual?

Questions and answers

Subscribe to Our Youtube Channel

Related Manuals for Quectel EC800M Series

Summary of Contents for Quectel EC800M Series

  • Page 1 EC800M-CN QuecOpen Hardware Design LTE Standard Module Series Version: 1.1 Date: 2023-07-28 Status: Released...

  • Page 2: Legal Notices

    LTE Standard Module Series At Quectel, our aim is to provide timely and comprehensive services to our customers. If you require any assistance, please contact our headquarters: Quectel Wireless Solutions Co., Ltd. Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District,...

  • Page 3: Third-Party Rights

    Privacy Policy To implement module functionality, certain device data are uploaded to Quectel’s or third-party’s servers, including carriers, chipset suppliers or customer-designated servers. Quectel, strictly abiding by the relevant laws and regulations, shall retain, use, disclose or otherwise process relevant data for the purpose of performing the service only or as permitted by applicable laws.

  • Page 4: Safety Information

    Manufacturers of the cellular terminal should notify users and operating personnel of the following safety information by incorporating these guidelines into all manuals of the product. Otherwise, Quectel assumes no liability for customers’ failure to comply with these precautions.

  • Page 5: About The Document

    LTE Standard Module Series About the Document Revision History Version Date Author Description Mark YANG/ 2022-12-05 Janko LI/ Creation of the document Sharon LI Mark YANG/ 2023-01-03 Janko LI/ First official release Sharon LI 1. Updated the USB serial drivers (Table 4). 2.

  • Page 6: Table Of Contents

    LTE Standard Module Series Contents Safety Information ............................3 About the Document ........................... 4 Contents ............................... 5 Table Index ..............................8 Figure Index ............................... 10 Introduction ............................12 1.1. Special Mark ..........................12 Product Overview ..........................13 2.1. Frequency Bands and Functions ..................... 13 2.2.
  • Page 7 LTE Standard Module Series 4.10. Analog Audio Interfaces ......................49 4.10.1. Audio Interface Design Considerations ................. 50 4.10.2. Microphone Interface Reference Design ............... 51 4.10.3. Earpiece Interface Reference Design ................52 4.10.4. Loudspeaker Interface Reference Design ..............52 4.11. ADC Interfaces ........................53 4.12.
  • Page 8 LTE Standard Module Series 8.3.4. Packaging Process ......................80 Appendix References ........................81 EC800M-CN_QuecOpen_Hardware_Design 7 / 84...
  • Page 9 LTE Standard Module Series Table Index Table 1: Special Mark ..........................12 Table 2: Basic Information .......................... 13 Table 3: Frequency Bands and Functions ....................13 Table 4: Key Features ..........................14 Table 5: Parameter Definition ........................19 Table 6: Pin Description ..........................20 Table 7: Overview of Operating Modes ......................
  • Page 10 LTE Standard Module Series Table 42: Operating and Storage Temperatures (Unit: ° C) ................ 70 Table 43: Recommended Thermal Profile Parameters ................77 Table 44: Carrier Tape Dimension Table (Unit: mm) .................. 78 Table 45: Plastic Reel Dimension Table (Unit: mm) ................... 79 Table 46: Related Documents ........................
  • Page 11 LTE Standard Module Series Figure Index Figure 1: Functional Diagram ........................17 Figure 2: Pin Assignment (Top View) ......................18 Figure 3: Schematic Diagram of Module Power Consumption in Sleep Mode ......... 28 Figure 4: Sleep Mode Application without Suspend Function ..............28 Figure 5: Reference Design of Power Input ....................
  • Page 12 LTE Standard Module Series Figure 42: Module Dimensions (Bottom View)................... 72 Figure 43: Recommended Footprint (Top View) ..................73 Figure 44: Top View and Bottom View of the Module ................74 Figure 45: Recommended Reflow Soldering Thermal Profile ..............76 Figure 46: Carrier Tape Dimension Drawing ....................

  • Page 13: Introduction

    LTE Standard Module Series Introduction ® QuecOpen is a solution where the module acts as the main processor. Constant transition and evolution of both the communication technology and the market highlight its merits. It can help you to: ⚫ Realize embedded applications’ quick development and shorten product R&D cycle ⚫...

  • Page 14: Product Overview

    LTE Standard Module Series Product Overview The module is an SMD type module with compact packaging, which is engineered to meet the demands in M2M and IoT applications, for instance: ⚫ ⚫ ⚫ ⚫ Tracker ⚫ Data card ⚫ Security system ⚫...

  • Page 15: Key Features

    LTE Standard Module Series NOTE GNSS function of the module is optional. ⚫ If the module with GNSS function is selected, analog audio input channel requires an external microphone bias circuit. And MICBIAS must be provided with 1.8 V power supply by using a low- noise LDO.
  • Page 16 ⚫ ADC Interfaces Supports two ADC interfaces ⚫ Network Indication NET_STATUS: indicates network registration status ⚫ Compliant with 3GPP TS 27.007, 3GPP TS 27.005 and Quectel enhanced AT Commands AT commands ⚫ Main antenna interface (ANT_MAIN) ⚫ Antenna Interfaces GNSS antenna interface (ANT_GNSS) (optional) ⚫...

  • Page 17: Functional Diagram

    LTE Standard Module Series ⚫ Supports GNSS positioning (optional) ⚫ Compliant with TCP, UDP, PPP*, NTP, NITZ, FTP, HTTP, PING, CMUX*, Internet Protocol HTTPS, FTPS, SSL, FILE, MQTT, MMS*, SMTP* SMTPS* protocols Features ⚫ Compliant with PPP protocol’s PAP and CHAP authentication ⚫...
  • Page 18 LTE Standard Module Series ANT_MAIN ANT_GNSS VBAT GNSS Frontend RF Frontend GNSS VBAT Transceiver PWRKEY VDD_EXT Baseband Flash & RAM NET_STATUS STATUS USB_BOOT Matrix ADCs RESET_N Camera USIMs I2Cs UARTs keypad Figure 1: Functional Diagram EC800M-CN_QuecOpen_Hardware_Design 17 / 84...

  • Page 19: Pin Assignment

    RESERVED Pin 44 can be selected as power supply pin for RTC of GNSS. The voltage domain is 1.65–3.6 V, with a typical value of 1.8 V, and 50 μA external current should be provided. A 1 μF filter capacitor is needed to be placed close to the pin. For more details, please contact Quectel Technical Support.

  • Page 20: Pin Description

    LTE Standard Module Series ⚫ If the module with GNSS function is selected, analog audio input channel requires an external microphone bias circuit. And MICBIAS must be provided with 1.8 V power supply by using a low-noise LDO. Only USIM1 interface is supported in this situation. ⚫...
  • Page 21 LTE Standard Module Series Table 6: Pin Description Power Supply Input Pin Name Pin No. Description DC Characteristics Comment External power supply must be provided with sufficient current up to Vmax = 4.3 V 2.0 A. Power supply for VBAT 42, 43 Vmin = 3.4 V It is recommended to...
  • Page 22 LTE Standard Module Series operation status USB Interface Pin Name Pin No. Description DC Characteristics Comment USB differential Complies with USB 2.0. USB_DP data (+) A differential impedance of 90 Ω is needed. Test USB differential USB_DM points must be data (-) reserved.
  • Page 23 LTE Standard Module Series Auxiliary UART AUX_TXD transmit Main UART Interface Pin Name Pin No. Description DC Characteristics Comment Main UART MAIN_RXD receive Main UART MAIN_TXD transmit Main UART data If unused, keep them MAIN_DTR terminal ready open. Main UART ring MAIN_RI indication 1.8 V...
  • Page 24 LTE Standard Module Series PCM data frame open. PCM_SYNC sync PCM_DIN PCM data input PCM_DOUT PCM data output Analog Audio Interfaces Pin Name Pin No. Description DC Characteristics Comment Microphone MIC_P analog input (+) If unused, keep them Microphone open. MIC_N analog input (-) Analog audio...
  • Page 25 LTE Standard Module Series Pin Name Pin No. Description DC Characteristics Comment GRFC1 Generic RF If unused, keep them Controller open. GRFC2 LCM Interface Pin Name Pin No. Description DC Characteristics Comment LCD_RST LCD reset LCD_SPI_DOUT LCD data output LCD register LCD_SPI_RS If unused, keep them select...
  • Page 26 1. RESERVED Pin 44 can be selected as power supply pin for RTC of GNSS. The voltage domain is 1.65–3.6 V, with a typical value of 1.8 V, and 50 μA external current should be provided. A 1 μF filter capacitor is needed to be placed close to the pin. For more details, please contact Quectel Technical Support.

  • Page 27: Evb Kit

    6. Do not pull USB_BOOT/KP_MKOUT[4] to low level before the module is successfully startup. 2.6. EVB Kit To help you develop applications with the module, Quectel supplies an evaluation board (LTE OPEN EVB) with accessories to control or test the module. For more details, see document [1].

  • Page 28: Operating Characteristics

    LTE Standard Module Series Operating Characteristics 3.1. Operating Modes Table 7: Overview of Operating Modes Modes Functions Software is active. The module is registered on the network but Idle there is no data interaction. Full Functionality Mode Network connection is ongoing. Power consumption is decided by Voice/Data the network setting and data transmission rate.

  • Page 29: Sleep Mode

    LTE Standard Module Series 3.2. Sleep Mode In sleep mode, power consumption of the module can be reduced to a minimal level. DRX OFF ON Run time Figure 3: Schematic Diagram of Module Power Consumption in Sleep Mode NOTE The DRX cycle value is sent by the base station through a wireless network. The following three conditions should be met to set the module into sleep mode.

  • Page 30: Airplane Mode

    LTE Standard Module Series You can wake up the module by turning on the power switch to power the USB_VBUS or by using GPIO interrupts. NOTE 1. Pay attention to the level matching shown in the dotted line between the module and the host in the circuit diagrams.

  • Page 31: Power Supply

    LTE Standard Module Series 3.4. Power Supply 3.4.1. Power Supply Interface The module provides two VBAT pins dedicated for connection with the external power supply: Table 8: Pin Description of Power Supply Interface Pin Name Pin No. Description Comment External power supply must be provided with sufficient current up to 2.0 A.

  • Page 32: Power Supply Voltage Detection

    LTE Standard Module Series ⚫ NOTE To avoid corrupting internal flash, do not cut off the power supply when the module works normally. Only after shutting down the module with PWRKEY or ql_power_down(), can you cut off the power supply. 3.4.3.

  • Page 33: Turn On

    LTE Standard Module Series 3.5. Turn On 3.5.1. Turn On with PWRKEY Table 9: Pin Description of PWRKEY Pin Name Pin No. Description Comment Pull down PWRKEY to turn on/off the PWRKEY Turn on/off the module module. It is recommended to reserve a test point.

  • Page 34: Turn Off

    LTE Standard Module Series NOTE 1 VBAT 700 ms 0.5 V PWRKEY About 10 ms VDD_EXT USB_BOOT/ USB_BOOT/KP_MKOUT[4] can be driven low KP_MKOUT[4] externally after this time period. About 27 ms RESET_N STATUS 10 s UART Active Inactive 10 s Inactive Active Figure 9: Timing Sequence of Turn-on with PWRKEY...

  • Page 35: Turn Off With Api

    LTE Standard Module Series VBA T 2 s ~ 10 s PWRKEY STATUS Module Power-down procedure Running Status Figure 10: Timing Sequence of Turn-off with PWRKEY 3.6.2. Turn Off with API It is also a safe way to use ql_power_down() to turn off the module, which is similar to turning off the module via PWRKEY pin.
  • Page 36 LTE Standard Module Series The recommended circuit for reset function is similar to PWRKEY control circuit, you can use open drain/collector driver or button to control RESET_N. ≥ 300 ms RESET_N Reset pulse 4.7K GPIO Module Figure 11: Reference Design of Reset with Driving Circuit RESET_N Reset pulse Module...
  • Page 37 LTE Standard Module Series NOTE 1. Use RESET_N only when you fail to turn off the module with the ql_power_down() or PWRKEY. 2. Make sure the capacitance on PWRKEY and RESET_N never exceeds 10 nF. EC800M-CN_QuecOpen_Hardware_Design 36 / 84...

  • Page 38: Application Interfaces

    LTE Standard Module Series Application Interfaces 4.1. USB Interface The module provides one integrated Universal Serial Bus (USB) interface which complies with the USB 2.0 specifications and supports High-Speed (480 Mbps) and Full-Speed (12 Mbps) on USB 2.0. The USB interface can be used for AT command communication, data transmission, GNSS NMEA message output, software debugging and firmware upgrade.

  • Page 39: Emergency Download Interface

    LTE Standard Module Series It is recommended to add a common-mode choke L1 in series between MCU and the module to suppress EMI spurious transmission. Meanwhile, it is also suggested to add R1 and R2 in series between the module and test points for debugging. These resistors are not mounted by default. To ensure the signal integrity of USB 2.0 data transmission, L1, R1 and R2 should be placed close to the module, and resistors should be placed close to each other.
  • Page 40 LTE Standard Module Series Module Test points 4.7K USB_BOOT/ KP_MKOUT[4] Close to the test points Figure 15: Reference Design of USB_BOOT NOTE 1 ≥ 700 ms VBAT ≤ 0.5 V PWRKEY About 10 ms VDD_EXT USB_BOOT / K P _ M K O U T [ 4 ] c a n b e driven low to GND before module’s startup, and the module will enter into USB_BOOT/...

  • Page 41: Usim Interfaces

    LTE Standard Module Series 4. The 6.0.1 and above version QFlash tool must be used for firmware upgrading. 4.3. USIM Interfaces The USIM interfaces meet ETSI and IMT-2000 requirements. Either 1.8 V or 3.0 V USIM card is supported. Table 13: Pin Description of USIM Interfaces Pin Name Pin No.
  • Page 42 LTE Standard Module Series VDD_EXT USIM_VDD 100 nF USIM Card Connector USIM_VDD USIM_RST Module USIM_CLK Switch USIM_DET USIM_DATA 33 pF 33 pF 33 pF TVS Array Figure 17: Reference Design of USIM Interface with an 8-pin USIM Card Connector If the USIM card detection function is not needed, keep USIM_DET open. A reference circuit for USIM interface with a 6-pin USIM card connector is illustrated in the following figure.

  • Page 43: Uart

    LTE Standard Module Series debugging. The 33 pF capacitors in parallel on USIM_DATA, USIM_CLK and USIM_RST lines are used for filtering RF interference. Additionally, keep the USIM peripheral circuit close to the USIM card connector. ⚫ The pull-up resistor on USIM_DATA can improve anti-jamming capability of the USIM card. If the USIM card traces are too long, or the interference source is relatively close, it is recommended to add a pull-up resistor near the USIM card connector.
  • Page 44 LTE Standard Module Series Table 15: Pin Description of UART Interface Pin Name Pin No. Description Comment MAIN_RXD Main UART receive MAIN_TXD Main UART transmit 1.8 V power domain. If unused, MAIN_DTR Main UART data terminal ready keep them open. MAIN_RI Main UART ring indication MAIN_DCD...

  • Page 45: Pcm Interface And I2C Interfaces

    LTE Standard Module Series Another example of level-shifting circuit is shown as below. Refer to the solid line for input/output circuit design in the dotted line below, but remember to follow the input/output sequence from or towards the module. 4.7K VDD_EXT VDD_EXT 1 nF...
  • Page 46 LTE Standard Module Series PCM_DIN PCM data input PCM_DOUT PCM data output Table 17: Pin Description of I2C Interfaces Pin Name Pin No. Description Comment I2C2_SDA I2C2 serial data An external 1.8 V pull-up I2C2_SCL I2C2 serial clock resistor is required. If unused, keep them I2C1_SDA I2C1 serial data...

  • Page 47: Spi

    LTE Standard Module Series The following figure shows a reference design of I2C and PCM interfaces with an external codec IC. MICBIAS PCM_CLK BCLK PCM_SYNC LRCK PCM_DOUT PCM_DIN LOUTP I2C_SCL I2C_SDA LOUTN Module Codec 1.8 V Figure 22: Reference Design of PCM and I2C Interfaces NOTE 1.

  • Page 48: Lcm Interface

    LTE Standard Module Series output signals; when the module is used as slave device*, SPI0_CLK and SPI0_CS pins are input signals. The following figure shows a reference design of SPI connected peripherals’ circuit： SPI0_CS SPI_CS SPI_CLK SPI0_CLK SPI0_DOUT SPI_MOSI SPI_MISO SPI0_DIN Module Peripherals...

  • Page 49: Matrix Keypad Interfaces

    LTE Standard Module Series Table 19: Pin Definition of LCM Interface Pin Name Pin No. Description Comment LCD_RST LCD reset LCD_SPI_DOUT LCD SPI data output LCD_SPI_RS LCD SPI register select 1.8 V power domain. If unused, keep them open. LCD_SPI_CS LCD SPI chip select LCD_SPI_CLK LCD SPI clock...

  • Page 50: Camera Interface

    LTE Standard Module Series 4.9. Camera Interface The module’s camera interface supports up to 0.3 MP and supports the single data line or dual data line transmission of SPI. Table 21: Pin Definition of Camera Interface Pin Name Pin No. Description Comment CAM_MCLK...

  • Page 51: Audio Interface Design Considerations

    LTE Standard Module Series Used for earpiece. SPK_P Analog audio differential output (+) The interface can drive 32 Ω earpiece with power rate at 37 mW @ THD = 1 %. It can also be used to drive SPK_N Analog audio differential output (-) external power amplifier devices if the output power rate cannot meet the demand.

  • Page 52: Microphone Interface Reference Design

    LTE Standard Module Series 4.10.2. Microphone Interface Reference Design Close to Module Close to MICBIAS Microphone 100 nF 510R Differential layout 10 pF 33 pF 2.2 µF Module 1.5K 100 nF MIC_P 10 pF 33 pF MIC_N Electret Microphone 100 nF 1.5K 10 pF 33 pF...

  • Page 53: Earpiece Interface Reference Design

    LTE Standard Module Series Figure 25 for microphone interface circuit design. The module requires no external microphone bias circuit if the module without GNSS function is selected, see Figure 26 for microphone interface circuit design. 4.10.3. Earpiece Interface Reference Design Close to earpiece 10 pF 33 pF...

  • Page 54: Adc Interfaces

    LTE Standard Module Series For differential input and output audio power amplifiers, please visit http://www.ti.com/ to obtain the required devices. There are also many audio power amplifiers with the same performance to choose from the market. 4.11. ADC Interfaces The module provides two ADC interfaces. To improve the accuracy of ADC, the trace of ADC interfaces should be surrounded by ground.

  • Page 55: Indication Signal

    LTE Standard Module Series 4.12. Indication Signal Table 25: Pin Description of Indication Signal Pin Name Pin No. Description Comment Indicate the module’s NET_STATUS network activity status 1.8 V power domain. Indicate the module’s If unused, keep them open. STATUS operation status 4.12.1.

  • Page 56: Status

    LTE Standard Module Series 4.12.2. STATUS STATUS indicates the module’s operation status. It will output high level when module is turned on successfully. VBAT Module 2.2K 4.7K STATUS Figure 30: Reference Design of STATUS EC800M-CN_QuecOpen_Hardware_Design 55 / 84...

  • Page 57: Rf Specifications

    LTE Standard Module Series RF Specifications Appropriate antenna type and design should be used with matched antenna parameters according to specific application. It is required to perform a comprehensive functional test for the RF design before mass production of terminal products. The entire content of this chapter is provided for illustration only. Analysis, evaluation and determination are still necessary when designing target products.

  • Page 58: Transmitting Power

    LTE Standard Module Series LTE-TDD B38 2570–2620 2570–2620 LTE-TDD B39 1880–1920 1880–1920 LTE-TDD B40 2300–2400 2300–2400 LTE-TDD B41 2535–2675 2535–2675 NOTE Band 41 only supports 140 MHz (2535–2675 MHz). 5.1.2. Transmitting Power Table 29: RF Transmitting Power Frequency Max. Min. LTE-FDD B1/B3/B5/B8 23 dBm ±...

  • Page 59: Reference Design

    LTE Standard Module Series LTE-TDD B40 (10 MHz) -100.5 dBm -96.3 dBm LTE-TDD B41 (10 MHz) -99.0 dBm -94.3 dBm 5.1.4. Reference Design Use a π-type matching circuit for all the antenna interfaces for better cellular performance. Capacitors are not mounted by default. Main Module antenna...

  • Page 60: Antenna Interface & Frequency Bands

    LTE Standard Module Series For more details about ql_gnss_open(), see document [9]. 5.2.1. Antenna Interface & Frequency Bands Table 31: Pins Description of GNSS Antenna Interface Pin Name Pin No. Description Comment 50 Ω impedance. ANT_GNSS GNSS antenna interface If unused, keep it open. It is optional for the module.

  • Page 61: Reference Design

    LTE Standard Module Series NOTE 1. Tracking sensitivity: the minimum GNSS signal power at which the module can maintain lock of navigation signals (keep positioning for at least 3 minutes continuously). 2. Reacquisition sensitivity: the minimum GNSS signal power required for the module to maintain lock within 3 minutes after loss of lock.

  • Page 62: Gnss Passive Antenna

    LTE Standard Module Series 5.2.3.2. GNSS Passive Antenna GNSS passive antenna connection reference circuit is shown in the figure below. GNSS Module Antenna ANT_GNSS Figure 33: Reference Design of GNSS Passive Antenna C1, R1 and C2 form the matching circuit, which is recommended to be reserved for adjusting the antenna impedance.
  • Page 63 LTE Standard Module Series characteristic impedance. The following are reference designs of microstrip or coplanar waveguide with different PCB structures. Figure 34: Microstrip Design on a 2-layer PCB Figure 35: Coplanar Waveguide Design on a 2-layer PCB Figure 36: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground) Figure 37: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground) EC800M-CN_QuecOpen_Hardware_Design 62 / 84...

  • Page 64: Requirements For Antenna Design

    LTE Standard Module Series To ensure RF performance and reliability, follow the principles below in RF layout design: ⚫ Use an impedance simulation tool to accurately control the characteristic impedance of RF traces to 50 Ω. ⚫ The GND pins adjacent to RF pins should not be designed as thermal relief pads, and should be fully connected to ground.

  • Page 65: Rf Connector Recommendation

    LTE Standard Module Series 5.5. RF Connector Recommendation If the RF connector is used for antenna connection, it is recommended to use U.FL-R-SMT receptacle provided by Hirose. Figure 38: Dimensions of the Receptacle (Unit: mm) U.FL-LP series mated plugs listed in the following figure can be used to match the U.FL-R-SMT connector.
  • Page 66 LTE Standard Module Series The following figure describes the space factor of the mated connectors. Figure 40: Space Factor of the Mated Connectors (Unit: mm) For more details, visit http://www.hirose.com. EC800M-CN_QuecOpen_Hardware_Design 65 / 84...

  • Page 67: Electrical Characteristics & Reliability

    LTE Standard Module Series Electrical Characteristics & Reliability 6.1. Absolute Maximum Ratings Table 35: Absolute Maximum Ratings Parameters Min. Max. Unit Voltage at VBAT -0.3 Voltage at USB_VBUS -0.3 Voltage at digital pins -0.3 Voltage at ADC0 Voltage at ADC1 Current at VBAT 6.2.

  • Page 68: Power Consumption

    LTE Standard Module Series 6.3. Power Consumption Table 37: Power Consumption Typ. State Conditions Units Without GNSS With GNSS μA OFF state Power down 21.23 38.72 Minimum Functionality Mode (USB 0.89 1.01 disconnected) Airplane Mode (USB disconnected) 1.01 1.13 LTE-FDD @ PF = 32 (USB 1.82 1.96 disconnected)

  • Page 69: Digital I/O Characteristics

    LTE Standard Module Series transmission LTE-FDD B3 LTE-FDD B5 LTE-FDD B8 LTE-TDD B34 LTE-TDD B38 LTE-TDD B39 LTE-TDD B40 LTE-TDD B41 6.4. Digital I/O Characteristics Table 38: 1.8 V I/O Characteristics (Unit: V) Parameters Descriptions Min. Max. Input high voltage 0.7 ×...

  • Page 70: Esd

    LTE Standard Module Series Table 40: USIM High-voltage I/O Characteristics (Unit: V) Parameters Descriptions Min. Max. USIM_VDD Power supply Input high voltage 0.7 × USIM_VDD USIM_VDD Input low voltage 0.15 × USIM_VDD Output high voltage 0.7 × USIM_VDD USIM_VDD Output low voltage 0.15 ×...

  • Page 71: Operating And Storage Temperatures

    LTE Standard Module Series 6.6. Operating and Storage Temperatures Table 42: Operating and Storage Temperatures (Unit: ° C) Parameters Min. Typ. Max. Normal Operating Temperature Extended Operating Temperature Storage Temperature Within this range, the module can meet 3GPP specifications. Within this range, the module remains the ability to establish and maintain functions such as voice, SMS, data transmission, emergency call* without any unrecoverable malfunction.

  • Page 72: Mechanical Information

    LTE Standard Module Series Mechanical Information This chapter describes the mechanical dimensions of the module. All dimensions are measured in millimeter (mm), and the dimensional tolerances are ± 0.2 mm unless otherwise specified. 7.1. Mechanical Dimensions Figure 41: Module Top and Side Dimensions EC800M-CN_QuecOpen_Hardware_Design 71 / 84...
  • Page 73 LTE Standard Module Series Figure 42: Module Dimensions (Bottom View) NOTE The package warpage level of the module conforms to JEITA ED-7306 standard. EC800M-CN_QuecOpen_Hardware_Design 72 / 84...

  • Page 74: Recommended Footprint

    LTE Standard Module Series 7.2. Recommended Footprint Figure 43: Recommended Footprint (Top View) NOTE Keep at least 3 mm between the module and other components on the motherboard to improve soldering quality and maintenance convenience. EC800M-CN_QuecOpen_Hardware_Design 73 / 84...

  • Page 75: Top And Bottom Views

    Figure 44: Top View and Bottom View of the Module NOTE Images above are for illustration purpose only and may differ from the actual module. For authentic appearance and label, please refer to the module received from Quectel. EC800M-CN_QuecOpen_Hardware_Design 74 / 84...

  • Page 76: Storage, Manufacturing And Packaging

    LTE Standard Module Series Storage, Manufacturing and Packaging 8.1. Storage Conditions The module is provided with vacuum-sealed packaging. MSL of the module is rated as 3. The storage requirements are shown below. 1. Recommended Storage Condition: the temperature should be 23 ± 5 ° C and the relative humidity should be 35–60 %.

  • Page 77: Manufacturing And Soldering

    LTE Standard Module Series NOTE 1. To avoid blistering, layer separation and other soldering issues, extended exposure of the module to the air is forbidden. 2. Take out the module from the package and put it on high-temperature-resistant fixtures before baking.
  • Page 78 5. Avoid using ultrasonic technology for module cleaning since it can damage crystals inside the module. 6. Due to the complexity of the SMT process, please contact Quectel Technical Support in advance for any situation that you are not sure about, or any process (e.g. selective soldering, ultrasonic soldering) that is not mentioned in document [11].

  • Page 79: Packaging Specifications

    LTE Standard Module Series 8.3. Packaging Specifications This chapter describes only the key parameters and process of packaging. All figures below are for reference only. The appearance and structure of the packaging materials are subject to the actual delivery. The module adopts carrier tape packaging and details are as follow: 8.3.1.

  • Page 80: Plastic Reel

    LTE Standard Module Series 8.3.2. Plastic Reel Figure 47: Plastic Reel Dimension Drawing Table 45: Plastic Reel Dimension Table (Unit: mm) øD1 øD2 32.5 8.3.3. Mounting Direction Figure 48: Mounting Direction EC800M-CN_QuecOpen_Hardware_Design 79 / 84...
  • Page 81 LTE Standard Module Series 8.3.4. Packaging Process Place the module into the carrier tape and use the cover tape to cover it; then wind the heat-sealed carrier tape to the plastic reel and use the protective tape for protection. 1 plastic reel can load 500 modules.

  • Page 82: Appendix References

    LTE Standard Module Series Appendix References Table 46: Related Documents Document Name [1] Quectel_LTE_OPEN_EVB_User_Guide [2] Quectel_ECx00M&ECx00N&EC800K_Series_QuecOpen_Device_Management_API_Reference_ Manual [3] Quectel_ECx00M&ECx00N&EC800K_Series_QuecOpen_Low_Power_Consumption_API_ Reference_Manual [4] Quectel_ECx00M&ECx00N&EC800K_Series_QuecOpen_ADC_Development_Guide [5] Quectel_ECx00M&ECx00N&EC800K_Series_QuecOpen_Booting&Shutdown_User_Guide [6] Quectel_ECx00M&ECx00N&EC800K_Series_QuecOpen_SIM_API_Reference_Manual [7] Quectel_EC800M-CN_QuecOpen_GPIO_Configuration [8] Quectel_EC800M-CN_QuecOpen_Reference_Design [9] Quectel_EC200M-CN&EC800M-CN_QuecOpen_GNSS_API_Reference_Manual [10] Quectel_RF_Layout_Application_Note [11] Quectel_Module_SMT_Application_Note Table 47: Terms and Abbreviations Abbreviation Description 3GPP...
  • Page 83 LTE Standard Module Series Circular Error Probable CHAP Challenge Handshake Authentication Protocol CMUX Connection MUX Clear To Send DFOTA Delta Firmware Upgrade Over-The-Air Discontinuous Reception Electrostatic Discharge Equivalent Series Resistance ETSI European Telecommunications Standards Institute Evaluation Board Frequency Division Duplexing FILE File Protocol File Transfer Protocol...
  • Page 84 LTE Standard Module Series Low-dropout Regulator Light Emitting Diode Land Grid Array Long Term Evolution Microcontroller Unit Mobile Equipment MLCC Multi-layer Ceramic Capacitor Multimedia Messaging Service MQTT Message Queuing Telemetry Transport NITZ Network Identity and Time Zone NMEA National Marine Electronics Association Network Time Protocol Over The Top Power Amplifier...
  • Page 85 LTE Standard Module Series RoHS Restriction of Hazardous Substances Real-Time Clock Request To Send Short Message Service SMTP Simple Mail Transfer Protocol SMTPS Simple Mail Transfer Protocol Secure Serial Peripheral Interface Secure Sockets Layer Transmission Control Protocol Time Division Duplexing Total Harmonic Distortion Transient Voltage Suppressor UART...

This manual is also suitable for:

Ec800m-cn