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The HD3SS460 is a high-speed passive crosspoint switch designed to support low- and high-speed signal
switching required for Type C, with Alternate mode applications. This guide describes how to bring up the
EVM and includes schematics that can be used as reference design for the Alternate mode
implementations of the host systems with the HD3SS460 device.
1
2
2.1
2.2
2.3
External PD/CC Controller Connection
3
4
5
1
2
Test Board Setup
3
Alternate Mode Over Type C Specification
4
5
6
7
8
Schematic (Page 1 of 3)
9
Schematic (Page 2 of 3)
10
Schematic (Page 3 of 3)
SLLU214D - February 2015 - Revised May 2016
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Copyright © 2015-2016, Texas Instruments Incorporated
SLLU214D - February 2015 - Revised May 2016
HD3SS460EVM-SRC
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List of Figures
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User's Guide
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HD3SS460EVM-SRC
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Summary of Contents for Texas Instruments HD3SS460
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Page 1: Table Of Contents
SLLU214D – February 2015 – Revised May 2016 HD3SS460EVM-SRC The HD3SS460 is a high-speed passive crosspoint switch designed to support low- and high-speed signal switching required for Type C, with Alternate mode applications. This guide describes how to bring up the EVM and includes schematics that can be used as reference design for the Alternate mode implementations of the host systems with the HD3SS460 device. -
Page 2: Hd3Ss460Evm-Src
The EVM schematics shown in this document are based upon the pin assignment defined in the Alternate mode over Type C specification as shown in Figure HD3SS460EVM-SRC SLLU214D – February 2015 – Revised May 2016 Submit Documentation Feedback Copyright © 2015–2016, Texas Instruments Incorporated... - Page 3 RX2+/ML1+ Figure 3. Alternate Mode Over Type C Specification The following tables represent the example pin mapping to the HD3SS460 for the DP Source pin assignments C ,D, E and F, and DP Sink pin assignments C and D. SOURCE Pin Assignment Option C/E...
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Page 4: Hd3Ss460Evm-Src Configuration
3.3V SHUNT on pin 1–2 JMP2 is provided to configure the HD3SS460 for 4-lanes of DisplayPort or 2-lanes of DisplayPort + SS TX/RX. Make sure JMP2 is configured to match the configuration of the connected Type-C device. The JMP2 configuration must match between two nodes for correct operation. -
Page 5: Hd3Ss460 Ac Coupling Cap Placement Recommendation
0.1 µF ML2+ TX2+ ML2> TX2> ML3+ RX2+ ML3> RX2> Figure 4. HD3SS460 USB Host/DP Source Implementation Example With 0 V < SSTX/RX Vcm < 2 V USB3 Upstream Port No AC Coupling Caps SSRX SSTX RX1+ ML0+ RX1> ML0>... -
Page 6: Hd3Ss460 Usb Host/Dp Source With Ss Usb Vcm > 2 V Example
0.1 µF ML2> TX2> ML3+ RX2+ 0.1 µF ML3> RX2> Figure 6. HD3SS460 USB Host/DP Source With SS USB Vcm > 2 V Example Vcm > 2.0 V 500 nF 500 nF 100 lQ 100 lQ 100 lQ 100 lQ... -
Page 7: Hd3Ss460Evm-Src Schematics
SS TX/RX USB micro B Connector Power Switch VBUS VBUS VBUS Power barrel 5 to 3.3V Figure 8. Schematic (Page 1 of 3) SLLU214D – February 2015 – Revised May 2016 HD3SS460EVM-SRC Submit Documentation Feedback Copyright © 2015–2016, Texas Instruments Incorporated... - Page 8 Sheet Sheet Sheet Tuesday, February 17, 2015 Tuesday, February 17, 2015 Tuesday, February 17, 2015 Figure 9. Schematic (Page 2 of 3) HD3SS460EVM-SRC SLLU214D – February 2015 – Revised May 2016 Submit Documentation Feedback Copyright © 2015–2016, Texas Instruments Incorporated...
- Page 9 VBUS_micB_EN# FAULT# FAULT# ILIM_SEL ILIM ILIM0 ILIM1 R185 100K C101 TPS2555 0.1uF C102 33.2K 150uF Figure 10. Schematic (Page 3 of 3) SLLU214D – February 2015 – Revised May 2016 HD3SS460EVM-SRC Submit Documentation Feedback Copyright © 2015–2016, Texas Instruments Incorporated...
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Page 10: Bill Of Materials
Bill of Materials www.ti.com Bill of Materials Table 1 lists the HD3SS460EVM-SRC bill of materials (BOM). Table 1. HD3SS460 Bill of Materials Part # T.COEFF/ Volt Qty. Value Designators PKG/ Case Description Dist P/N MFG Part # Rated Customer 18461 0.1µF... - Page 11 Bill of Materials www.ti.com Table 1. HD3SS460 Bill of Materials (continued) Part # T.COEFF/ Volt Qty. Value Designators PKG/ Case Description Dist P/N MFG Part # Rated Customer 20654 AF 18 PB SPST-NO Off-Mom 6.50mm x 6.00mm Switches SW261CT-ND Omron Electronics...
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Page 12: Revision History
Changes from C Revision (January 2016) to D Revision ....................Page • Changed title of the HD3SS460 USB Host/DP Source Implementation Example With 0 V < SSTX/RX Vcm < 2 V ............................image. • Changed title and HD3SS460 USB Upstream/DP Sink Implementation Example With 0 V < SSTX/RX Vcm < 2 V ............................ - Page 13 STANDARD TERMS AND CONDITIONS FOR EVALUATION MODULES Delivery: TI delivers TI evaluation boards, kits, or modules, including any accompanying demonstration software, components, or documentation (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordance with the terms and conditions set forth herein. Acceptance of the EVM is expressly subject to the following terms and conditions.
- Page 14 FCC Interference Statement for Class B EVM devices NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation.
- Page 15 【無線電波を送信する製品の開発キットをお使いになる際の注意事項】 開発キットの中には技術基準適合証明を受けて いないものがあります。 技術適合証明を受けていないもののご使用に際しては、電波法遵守のため、以下のいずれかの 措置を取っていただく必要がありますのでご注意ください。 1. 電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用 いただく。 2. 実験局の免許を取得後ご使用いただく。 3. 技術基準適合証明を取得後ご使用いただく。 なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。 上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。 日本テキサス・イ ンスツルメンツ株式会社 東京都新宿区西新宿６丁目２４番１号 西新宿三井ビル 3.3.3 Notice for EVMs for Power Line Communication: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page 電力線搬送波通信についての開発キットをお使いになる際の注意事項については、次のところをご覧くださ い。http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page SPACER EVM Use Restrictions and Warnings: 4.1 EVMS ARE NOT FOR USE IN FUNCTIONAL SAFETY AND/OR SAFETY CRITICAL EVALUATIONS, INCLUDING BUT NOT LIMITED TO EVALUATIONS OF LIFE SUPPORT APPLICATIONS.
- Page 16 Notwithstanding the foregoing, any judgment may be enforced in any United States or foreign court, and TI may seek injunctive relief in any United States or foreign court. Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2015, Texas Instruments Incorporated...
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Page 17: Important Notice
IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue.
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