Acer S5201M Series Service Manual page 49

Fig. 5-3
5.4 Place Damper on the surface of Chip-BD Fig. 5-5.
6. Assembly OP ENG
6.1 Assemble "Baffle DMD" to "HSG DMD" (Fig 6-1).
6.2 Assemble "Sponge DMD" to "HSG DMD" (Fig 6-2).
6.3 Assemble Chip B/D Module to "HSG DMD" (Fig. 6-3、Fig. 6-4).
Alignment keying
Sponge
DMD
Baffle DMD
Fig. 6-1
Open notation
Fig. 5-5
Sponge DMD
49
Button
Close notation
Fig. 5-4
Damper
.
Fig.6-2