Texas Instruments TMUX10DGSEVM User Manual

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EVM User's Guide: TMUX10DGSEVM
TMUX10DGS Evaluation Module
Description
The TMUX10DGSEVM is used to evaluate the
performance of the 10 pin DGS package. The
evaluation module (EVM) comes with a pad to allow
10 pin DGS devices to be soldered on. Additionally,
test points on board are provided to allow for the
flexibility to test for various signals.
Features
• One power supply decoupling capacitor from VDD
to ground (3.3µF, 6mm × 5mm)
• Two additional power supply decoupling capacitor
pads from VDD to ground (6mm × 5mm)
• One power supply decoupling capacitor from VSS
to ground (3.3µF, 6mm × 5mm)
• Two additional power supply decoupling capacitor
pads from VSS to ground (6mm × 5mm)
• Pads available near VDD and VSS input for TVS
Diodes ( L × W: 8.13mm × 6.22mm)
TMUX10DGSEVM (Front Side)
SCDU038 – APRIL 2024
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• One pad for switches and multiplexers in the 10-
pin DGS package
• 10 generic 6-pin headers for power, analog or
digital signals being switched, and control signals
• All 10 generic signal pathways have 2 0805 size
0Ω resistors installed between IC pad and header
• All 10 generic signal pathways have 0603 sized
pads to add a pull-up, pull-down, or resistive load
to the signal pathway
• All 10 generic signal pathways contain an 1812
sized pad to add a capacitive load to the signal
pathway
• All 10 generic signal pathways contain a 1206
sized pad to add a capacitive load to the signal
pathway
• One common 3-port terminal block for GND, VDD,
and VSS power signals
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TMUX10DGSEVM (Back Side)
TMUX10DGS Evaluation Module
Description
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