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2.
Release the ZIF connectors (1) the I/O board cable and nano SIM cable are connected to, and then
disconnect the I/O board cable (2) and nano SIM cable from the system board.
To replace the I/O board cable, reverse the removal procedures.
Heat sink
To remove the heat sink, use these procedures and illustrations.
Table 6-8
Heat sink descriptions and part numbers
Description
For use on computer models equipped with a graphics subsystem with discrete memory
For use on computer models equipped with a graphics subsystem with UMA memory and a 28 W
processor
For use on computer models equipped with a graphics subsystem with UMA memory and a 15 W
processor
Before removing the heat sink, follow these steps:
1.
Prepare the computer for disassembly (see
2.
Disconnect the battery cable from the system board (see
3.
Remove the bottom cover (see
4.
Remove the WWAN module (see
5.
Remove the SSD (see
6.
Remove the fan (see
7.
Remove the system board (see
Remove the heat sink:
1.
Remove the four Phillips M2.0 × 2.5 screws (1) that secure the heat sink to the system board.
68
Chapter 6 Removal and replacement procedures for authorized service provider parts
Preparation for disassembly on page
Bottom cover on page
WWAN module on page
Solid-state drive on page
Fan on page
57).
System board on page
Battery on page
42).
45).
47).
62).
Spare part number
N96445-001
N96444-601
N96443-001
54).
54).
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