from the chassis.
SOLDAPULLT listed under soldering equipment, is recom
mended for removing solder from the board, thereby ex
pediting component removal and replacement. To remove
the entire board use the following procedure:
Check wire color code against Fig. 4-6. Note any excep
tions.
Disconnect all square-pin connectors from the exposed
side of the board.
Disconnect the 8 square-pin connectors from the underside
of the board.
PROBE STEP ATTEN BAL (R158)
®
http://manoman.sqhill.com
A solder removing device, such as the
STEP ATTEN BAL (R129)
(sketched from reor)
(sketched from rear)
VAR BAL (R330)
(sketched from rear)
At the board, unsolder the 5 leads/components which go
to the DISPLAY switch.
At the DISPLAY switch, unsolder the 2 lead which go to
the attenuator section.
Remove the 8 hold-down screws from the board.
Move the board toward the rear of the chassis until com
ponents clear the DISPLAY switch. Then lift up on the rear
of the board and remove it from the chassis.
Replacement of the Input Amplifier board is done by
reversing the above procedure, insuring that the 2 leads from
Fig. 4-5. Component wiring.
Maintenance — Type 1A5
VARIABLE (R350)
(sketched from rear)
POSITION Range (R370)
(sketched from above)
POSITION (R372)
(sketched from below)
4-9
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