Tektronix 1A5 Instruction Manual page 44

Parts Procurement
All parts used in this instrument can be purchased through
Tektronix Field Offices or Representatives.
placements for standard electronic items .can readily be
obtained from local electronic parts stores.
chasing, consult the Electrical Parts List
termine the required specifications.
When selecting
to rememb e r that the physical size
component may affect its performance at high
frequencies. All
direct replacments unless
ferent component
ment performance.
Special Parts.
worked, quality checked, or manufactured by or for Tek ­
tronix to fulfill a specific requirement.
parts used are common to only Tektronix instruments,
a particular type of instrument. All electrical parts whose
stock number is preceded by an asterisk in Section 7, and
most mechanical parts, can be obtained only through Tek ­
tronix Field Offices or Representatives.
tion precedes the Electrical Parts List in Section 7.
Soldering Equiment and Techniques
Soldering Equipment. Soldering irons and solder should
be selected in accordance with the work being done.
Recommended combinations are as follows:
Soldering on circuit boards — 15- to 40-watt iron, ' /g-inch
tip, 3% silver-content solder only.
Soldering to metal terminals such as on switches and
potentiometers — 40- to 75-watt iron, ' /g-inch tip, 3% silver-
content solder or ordinary electrical solder.
Soldering to heavy metal such as the chassis or binding
posts — 40- to 75-watt iron, ¼ -inch tip, 3% silver-content
solder or ordinary electrical solder.
Solder containing 3% silver is used extensively
tronix instruments to provide proper bonding to circuit
board connections. Although adequate bonds can be made
once or twice with common solder,
degrade the circuitry.
well in all applications and is recommended for general
circuit repairs. It is available through most sales outlets
or can be obtained through Tektronix Field Representatives.
The Tektronix part number is 251-0514-00.
Component size and density demands the use of needle ­
nose pliers and needle-nose end nipper pliers when replac ­
ing components. Tweezers are also useful. Heat sinks such
as small alligator clips are invaluable in protecting compo ­
nents, leaving both hands free for soldering. A hold-down
aid can be made from a wooden dowel, 6 to 8 inches long
and ¼ to ⅜ inch in diameter. Shape one end like a pencil
tip and the other end similar to a screwdriver tip.
that the wood will absorb only a minimum of heat from
the iron, but will not guard against heat transfer to the
parts being soldered.
tipped swabs are needed to remove flux from soldered
connections to prevent corrosion.
http://manoman.sqhill.com
However, re ­
in Section 7 to de ­
NOTE
replacement parts, it is important
and shape of a
replacement parts should
it is known that
will not adversely affect
Some electrical parts are specially re ­
Most mechanical
Ordering informa ­
its continued
Solder containing 3% silver works
Flux remover solvent and cotton ­
A solder-removing device such as an
PULLT, Tektronix part number 003-0428-00, is extremely
useful in removing solder from circuit boards
component removal and replacement.
Before pur ­
Other soldering aids should be made or
suit specific needs.
General Soldering Techniques.
tip well tinned and wiped clean. To avoid excessive
ing of the general area around the connection, the iron
should be completely heated before being applied. When
removing components, heat only long enough to allow the
part to be removed easily. (Applying a small
be
solder between the tip and the joint will usually
a dif ­
transfer on
instru ­
of the general area.) Use the extreme tip of needle-nosed
pliers to avoid drawing off too much heat. When connecting
components, heat the solder sufficiently to allow free flow.
Apply the solder to the wire being joined, not to the solder ­
ing iron. This will insure proper bonding. Applying a small
amount of solder between the iron and the wire will again
or to
aid in initial heat transfer. Once solder flows between the
tip and the wire, the solder should be applied to the opposite
side of the wire to complete the process. Do not use more
solder than is necessary to make a neat and effective bond.
Use heat sinks between the body of the components and
the joint being soldered whenver small components and/or
short leads are involved. After soldering has been completed,
clip off excess wire, deflecting wire ends with a gloved
finger or other device to avoid damage to fingers, eyes or
ciricuit components. Remove clipped leads from the chassis.
Clean the newly soldered area with flux remover solvent
and a cotton-tipped swab.
Circuit Board Soldering Techniques. Use a 15 to 40 watt
iron with a ⅛- inch tip and solder containing 3% silver.
Keep the tip well tinned and clean. Do not overheat com ­
ponents or circuit board. Do not put excessive pressure on
the board.
To remove a component, grip a lead with the tip of a
pair of needle-nosed pliers. Touch the tip of the soldering
in Tek ­
iron to the connection. When the solder melts, gently pull
the lead from the board. If a clean hole is not left in the
board, reheat it and remove the solder with a solder remov ­
use will
ing device, or bore it out gently with a tooth-pick or a simi ­
lar non-abrasive device.
Defective multiple-lead components that cannot be re ­
moved by the above process should first be removed by cut ­
ting leads. Then remove leads one at a time and clean holes
as necessary.
To replace components, first bend the leads to proper
shape. Cut the leads to proper size if the extra lead length
interferes with installation, or cannot be reached for cutting
after installation. Insert the leads in holes and set the com-
penent to the position of the original part. Re-heat the holes
if necessary for proper insertion of the part. Apply
sinks to component leads as necessary. Apply the iron and
Note
a small amount of solder to the connection. Do not remove
the iron until the solder flows freely. Remove the iron and
hold the component steady until solder is firm. Clip excess
lead wire.
swab and flux remover.
Maintenance — Type 1A5
Keep the soldering iron
difficult connections. This will decrease
Clean the soldered area with a cotton-tipped
EDSYN SOLDA-
to expedite
purchased to
heat ­
amount of
aid in heat
heating
heat
4-7