SECTION 2: PRODUCT DESCRIPTION
Process and instrumentation diagram
Control Functions:
DV - Displa y Value
CHT - Chilled Liquid Temperature
HPC - High Pressure Cutout
LPC - Low Pressure Cutout
HPL - High Pressure Load Limiting
LTC - Low Temperature Cutout
ZCPR-3
ZCPR-2
Compressors
Low pressure liquid refrigerant enters the DX coil and
is evaporated and superheated by the heat energy
absorbed from the air passing through the DX coil.
Low pressure vapor
compressor where pressure and superheat are
increased. The high pressure vapor is fed to the air
cooled condenser coil and fans where the heat is
removed. The fully condensed and subcooled liquid
passes through the expansion valve where pressure is
reduced and further cooling takes place before
returning to the cooler.
FIGURE 6 - PROCESS AND INSTRUMENTATION DIAGRAM
28
Fans
Condenser
DV
585 PSIG
HPL
HPC
PS
ZCPR-1
DV
P
Ambient Air Sensor
LPC
S
-YLLSV
enters the
Fans
P
650 PSIG
See P.R.V .
Options
450 PSIG
DV
T
HTC
LT C
FORM QCC3-NM1
ISSUE DATE: 12/19/2023
Components:
Pressure Relief Valve
Ser vice (Ball) Valve
Expansion Valve
S
Solenoid Valve
Sight Glass
Sensor Pressure
or Temperature
Ser vice (Stop) Access Valve
Pressure Switch
PS
Filter Drier
(Remo vable Core)
LD14261A
Quantech
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