Related Manuals for S&T Kontron OSM-S i.MX8M Mini
Summary of Contents for S&T Kontron OSM-S i.MX8M Mini
- Page 1 USER GUIDE OSM-S i.MX8M Mini Doc. Rev. 0.5 www.kontron-electronics.de CONFIDENTIAL...
- Page 2 This page has been intentionally left blank www.kontron-electronics.de CONFIDENTIAL // 2...
- Page 3 OSM-S I.MX8M MINI - USER GUIDE Disclaimer Kontron Electronics would like to point out that the information contained in this user guide may be subject to altera- tion, particularly as a result of the constant upgrading of Kontron Electronics products. This document does not entail any guarantee on the part of Kontron Electronics with respect to technical processes described in the user guide or any product characteristics set out in the user guide.
- Page 4 www.kontron-electronics.de CONFIDENTIAL // 4...
- Page 5 Intended Use THIS DEVICE AND ASSOCIATED SOFTWARE ARE NOT DESIGNED, MANUFACTURED OR INTENDED FOR USE OR RESALE FOR THE OPERATION OF NUCLEAR FACILITIES, THE NAVIGATION, CONTROL OR COMMUNICA- TION SYSTEMS FOR AIRCRAFT OR OTHER TRANSPORTATION, AIR TRAFFIC CONTROL, LIFE SUPPORT OR LIFE SUSTAINING APPLICATIONS, WEAPONS SYSTEMS, OR ANY OTHER APPLICATION IN A HAZARDOUS EN- VIRONMENT, OR REQUIRING FAIL-SAFE PERFORMANCE, OR IN WHICH THE FAILURE OF PRODUCTS COULD LEAD DIRECTLY TO DEATH, PERSONAL INJURY, OR SEVERE PHYSICAL OR ENVIRONMENTAL DAMAGE (COL-...
- Page 6 Revision History Revision Brief Description of Changes Date of Issue thor/Ed itor Basic draft 2021-04-21 Updated pin mux table 2022-01-14 Updated product name 2022-03-08 Change to OSM V1.1 2022-04-27 Typo correction 2023-03-16 Updated pin mux table Customer Support Find Kontron Electronics contacts by visiting: http://www.kontron-electronics.de.
-
Page 7: Symbols
Symbols The following symbols may be used in this user guide DANGER indicates a hazardous situation which, if not avoided, will result in death or serious injury. WARNING indicates a hazardous situation which, if not avoided, could result in death or serious injury. NOTICE indicates a property damage message. -
Page 8: Special Handling And Unpacking Instruction
OSM-S i.MX8M Mini Rev. 0.5 Special Handling and Unpacking Instruction ESD Sensitive Device! Electronic boards and their components are sensitive to static electricity. Therefore, care must be taken during all handling operations and inspections of this product, in order to en- sure product integrity at all times. -
Page 9: Table Of Contents
Table of Contents Symbols ..........................................7 Special Handling and Unpacking Instruction ............................8 Quality and Environmental Management ..............................8 Table of Contents....................................... 9 List of Tables ........................................9 List of Figures ........................................10 Introduction ......................................11 Description ......................................12 2.1. Product Variants and Accessories ............................... 13 System Specifications .................................. -
Page 10: List Of Figures
Table 5: Mechanical Dimensions ................................20 Table 6: Pinout of OSM-S i.MX8M Mini ..............................32 Table 7: Supply voltage ....................................34 Table 8: Supply current VCC_IN_5V ................................34 Table 9: RTC_PWR current ................................... 34 Table 10: Output Current ....................................34 Table 11: FORCE_RECOVERY# pin settings .............................. -
Page 11: 1/ Introduction
1/ Introduction This user guide describes the 30mmx30mm SoM form factor module - OSM-S i.MX8M Mini . The Advanced RISC Ma- chines (ARM) based module is equipped with NXP i.MX8M Mini processor. The quad core SoC takes advantage of the optimized power consumption and performance ratio. -
Page 12: 2/ Description
2/ Description The OSM-S i.MX8M Mini is a very small System-on-Module (SoM) using NXPs i.MX8M Mini processor with ARM Quad Cortex A53 and Cortex M4. The OSM-S i.MX8M Mini is a highly integrated, small sized module for integra- tion in embedded systems with 30mmx30mm footprint. The module is compatible with SGETs OSM standard size The complexity of the DDR4 memory, power management and processor connection are contained in the SOM and simplifies baseboard development. -
Page 13: Product Variants And Accessories
2.1. Product Variants and Accessories Order Information: Table 1: Product Variants of OSM-S i.MX8M Mini Board Description Product Number OSM-S i.MX8M Mini SoM with NXP I.MX8M Mini quad core processor, 1 GB 40099 227 1GB/8GB -25..+85° LPDDR4 and 8 GB eMMC OSM-S i.MX8M Mini SoM with NXP I.MX8M Mini quad core processor, 2 GB 40099 229... -
Page 14: 3/ System Specifications
3/ System Specifications 3.1. Component Main Data The table below summarizes the features of the SoM. Table 2: Component Main Data OSM-S I.MX8MM Form factor 30x30mm with 332 LGA pads Processor NXP MIMX8MM6CVTKZAA with 14mm x 14mm BGA package in 0.5mm pitch (industrial version) up to 1.6 GHz Memory 1.6 GHz 32-bit LPDDR4... -
Page 15: Environmental Conditions
1x SAI (I2S) other Connectivity 2x SPI 1x PCIe Power Consumption Maximum Power consumption of the board is measured to <3,5 W Input Voltage Single Supply 5V ±5% 3.2. Environmental Conditions Table 3: Environmental Conditions Operating industrial: -25°C to 85°C ... -
Page 16: Functional Block Diagram
3.3. Functional Block Diagram The block diagram shows a detailed structure of the OSM-S i.MX8M Mini module. Figure 2: Block Diagram www.kontron-electronics.de CONFIDENTIAL // 16... -
Page 17: 4/ Board And Connectors
4/ Board and Connectors 4.1.1. Connectors Table 4: Connectors of OSM-S i.MX8M Mini Connector Function Remark LGA package Central Interface solderable 4.2. SoM view and locations Figure 3: Top View PMIC LPDDR4 eMMC i.MX8M Mini NOR-Flash www.kontron-electronics.de CONFIDENTIAL // 17... -
Page 18: Bottom Side
4.3. Bottom Side Figure 4: Bottom View Pin A1 (missing) Unique ID Test points (factory use only) Keep out area on base board www.kontron-electronics.de CONFIDENTIAL // 18... -
Page 19: Mechanical Drawings
4.4. Mechanical Drawings Figure 5: Dimensions of OSM-S i.MX8M Mini (top view) Figure 6: Footprint Grid www.kontron-electronics.de CONFIDENTIAL // 19... -
Page 20: Table 5: Mechanical Dimensions
Figure 7: Keep out area on baseboard (bottom view) Dimension Description Size 30 mm x 30 mm PCB Thickness 1.5 mm ± 0.1 mm Total height 2.5 ± 0.1 mm Weigth max. 5 g Table 5: Mechanical Dimensions www.kontron-electronics.de CONFIDENTIAL // 20... -
Page 21: Pinout Diagram Of Osm-S I.mx8M Mini
4.5. Pinout diagram of OSM-S i.MX8M Mini Figure 8: pin assignment (top view) CSI_ CSI_ CSI_ CSI_ UART_A_ UART_C_ DATA1_N DATA1_P DATA2_N DATA2_P CSI_ CSI_ CSI_ CSI_ CSI_ UART_A_ UART_C_ Vendor Defined DATA0_P CLOCK_N CLOCK_P DATA3_N DATA3_P I2C_CAM I2C_CAM CSI_ VCC_6_ UART_A_ UART_A_... -
Page 22: Pinout Of Osm-S I.mx8M Mini
4.5.1. Pinout of OSM-S i.MX8M Mini Pins Tool for i.MX Application Processors The pinout described here is the default pinout of the SoM in comparison to the OSM pinout. One can use multiplexing. The tool can be downloaded from nxp homepage. Changing the multiplexing creates the need of changing the device tree too. - Page 23 Contact Name OSM Contact CPU Contact Signal Name Functional Description I/O Type I/O Level PU / PD Comments Acronym BOOT_SEL1# SAI1_RXD4 GPIO4_IO06 I OD CMOS V_OUT_IO PU 10k The boot medium is the choice of the module ven- dor. FORCE_RECOVERY# BOOT_MODE0 __BOOT_MODE0 If low on carrier board module enters recovery mode.
- Page 24 Contact Name OSM Contact CPU Contact Signal Name Functional Description I/O Type I/O Level PU / PD Comments Acronym ETH_A_(S)(R)(G)MII ENET_TD1 ENET_TD1 Transmit data bit 1 port A O CMOS 1.8V _TXD1 ETH_A_(S)(R)(G)MII ENET_TD2 ENET_TD2 Transmit data bit 2 port A O CMOS 1.8V _TXD2...
- Page 25 Contact Name OSM Contact CPU Contact Signal Name Functional Description I/O Type I/O Level PU / PD Comments Acronym GPIO_B_3 SAI5_RXC GPIO3_IO21 General purpose I/O Contact B3 I/O CMOS V_OUT_IO GPIO_B_4 SAI1_RXD2 GPIO4_IO04 General purpose I/O Contact B4 I/O CMOS V_OUT_IO GPIO_B_5 SAI1_TXD2...
- Page 26 Contact Name OSM Contact CPU Contact Signal Name Functional Description I/O Type I/O Level PU / PD Comments Acronym SDIO_B_D4 NAND_RE_B SD3_DATA4 SDIO B Data lines. These signals operate in push-pull mode. I/O CMOS V_OUT_IO SDIO_B_D5 NAND_CE2_B SD3_DATA5 SDIO B Data lines. These signals operate in push-pull mode. I/O CMOS V_OUT_IO SDIO_B_D6...
- Page 27 Contact Name OSM Contact CPU Contact Signal Name Functional Description I/O Type I/O Level PU / PD Comments Acronym I2S_A_DATA_OUT SAI1_TXD0 SAI1_TXD0 I2S A Digital audio Output I/O CMOS V_OUT_IO I2S_B_DATA_IN SAI1_RXD1 SAI1_RXD1 I2S B Digital audio Input I/O CMOS V_OUT_IO I2S_B_DATA_OUT SAI1_TXD1...
- Page 28 Contact Name OSM Contact CPU Contact Signal Name Functional Description I/O Type I/O Level PU / PD Comments Acronym I2C_B_SDA AA21 I2C3_SDA I2C3_SDA I2C Port B Data Signal I/O OD CMOS V_OUT_IO PU 2k2 COM_AREA_01 n.c. COM_AREA_02 n.c. COM_AREA_03 n.c. COM_AREA_04 n.c.
- Page 29 Contact Name OSM Contact CPU Contact Signal Name Functional Description I/O Type I/O Level PU / PD Comments Acronym A4, A7, A10, B2, B5, B8, Module Signal and power return and GND reference B9, C11, D1, D5, D8, E2, H2, H4, L2, L4, P2, P4, R1, U2, U4, V1, W3, Y2, AA1, AA4, AA7, AA8, AA10, AA11, AB3, AB6,...
- Page 30 Contact Name OSM Contact CPU Contact Signal Name Functional Description I/O Type I/O Level PU / PD Comments Acronym GPIO_C_1 NAND_DATA01 GPIO3_IO07 General purpose I/O Contact C1 I/O CMOS V_OUT_IO GPIO_C_2 NAND_DATA02 GPIO3_IO08 General purpose I/O Contact C2 I/O CMOS V_OUT_IO GPIO_C_3 NAND_DATA03...
- Page 31 Contact Name OSM Contact CPU Contact Signal Name Functional Description I/O Type I/O Level PU / PD Comments Acronym I2C_CAM_SDA I2C4_SDA I2C4_SDA I2C data for serial camera data support link I/O OD CMOS V_OUT_IO PU 2.2K I2C_CAM_SCL I2C4_SCL I2C4_SCL I2C clock for serial camera data support link O OD CMOS V_OUT_IO PU 2.2K...
-
Page 32: Table 6: Pinout Of Osm-S I.mx8M Mini
Contact Name OSM Contact CPU Contact Signal Name Functional Description I/O Type I/O Level PU / PD Comments Acronym USB_C_D_N n.c. USB_C_D_P n.c. USB_C_ID n.c. USB_C_OC# n.c. USB_C_VBUS n.c. USB_C_EN n.c. USB_C_SSTX_N n.c. USB_C_SSTX_P n.c. USB_C_SSRX_N n.c. USB_C_SSRX_P n.c. PCIe_A_HSI0_P PCIE_RXN_P PCIE_RXN_P Differential PCIe link A receive data pair... -
Page 33: 5/ Installation
5/ Installation 5.1. Power Control 5.1.1. Power Supply The SoM can be powered from a single 5V power source at VCC_IN_5V pins. If the RTC is used RTC_PWR also needs to be powered. OSM pins VCC_IN_3V3 and V_BAT are not used. Figure 9: power supply scheme The following parameters should be delivered from the carrier board: ... -
Page 34: Supply Voltage
5.1.2. Supply voltage Table 7: Supply voltage Voltage nominal VCC_IN_5V RTC_PWR 5.1.3. Supply current The supply current is measured on the SoM using the following commands: Stresstest on all 4 CPUs: stress-ng --matrix 0 -t 0 Stresstest on all 4 CPUs and RAM: stress-ng --matrix 0 -t 0 --vm 4 --vm-bytes 50% Table 8: Supply current VCC_IN_5V Use case... -
Page 35: Io Voltage
There is no current limiting device for the voltage outputs. Drawing to much current may damage the device and/or lead to malfunction. 5.1.5. IO voltage As defined by the OSM standard, the IO voltage of the most pins is +1.8V by default (except size-0). As many systems still may run with +3.3V kontrons OSM SoM offers the possibility to switch IO voltage to +3.3V by pulling vendor de- fined pin B22 to GND. -
Page 36: Serial Downloader
It is recommended to have the SDIO_A (uSDHC2) available on the baseboard to boot from SD-card during development 5.3.2. Serial Downloader The Serial Downloader provides a means to download a program image to the chip over the USB OTG1 serial connec- tion. -
Page 37: Console
5.5. Console The linux console is one of the most important tools to access the SoM. The console can be used to send commands to the SoM and receive information from the SoM. It is recommended to have the console pins UART_CON available on the baseboard. www.kontron-electronics.de CONFIDENTIAL // 37... -
Page 38: 6/ Thermal Considerations
6/ Thermal considerations TO BE DEFINED CONTENT FOLLOWS WITH NEXT DOCUMENT VERSION www.kontron-electronics.de CONFIDENTIAL // 38... -
Page 39: 7/ Reflow Profile
7/ Reflow profile Table 12: Reflow profile Profile Feature Pb-Free Assembly Average Ramp-Up Rate (T to T 3°C/second max. SMAX Preheat Temperature Min (T 150 °C SMIN Temperature Max (T 200 °C SMAX Time (t ) from (T to T 60-120 seconds SMIN SMAX... -
Page 40: 8/ Technical Support
8/ Technical Support 8.1. First Steps -- - Startup-Information Baseboard For the first startup of your Board, which includes the OSM-S iMX8MM SoM, you will find more information about the Software / BSP and additional hardware information at the online documentation. Please follow the link https://docs.kontron-electronics.de/yocto-ktn/build-ktn-imx/ The online documentation is primarily intended for our Eval-Kit / Evalboard, but will help you also to put your board... -
Page 41: About Kontron Electronics
OSM-S i.MX8M Mini Rev. 0.5 About Kontron Electronics Kontron Electronics is your complete supplier of electronics and automation solutions. We offer own control products for the automation of machines and devices, Development and production for individual, complex electronic modules ...