Table Of Contents - Lenovo S14 Gen 3 Hardware Maintenance Manual

Contents
About this manual . . . . . . . . . . . . iii
Chapter 1. Safety information . . . . . . 1
General safety . . . . . . . . . . . . . . . . 1
Electrical safety . . . . . . . . . . . . . . . . 1
Safety inspection guide . . . . . . . . . . . . . 2
Handling devices that are sensitive to electrostatic
discharge . . . . . . . . . . . . . . . . . . 3
Grounding requirements . . . . . . . . . . . . 4
Safety notices (multilingual translations) . . . . . . 4
Chapter 2. General checkout . . . . . 21
What to do first . . . . . . . . . . . . . . .
CRU list . . . . . . . . . . . . . . . . . .
Chapter 3. Identifying FRUs
(CRUs) . . . . . . . . . . . . . . . . . 23
Locate FRUs and CRUs
Chapter 4. Removing a FRU or
CRU . . . . . . . . . . . . . . . . . . 33
Service tools . . . . . . . . . . . . . . . .
General guidelines . . . . . . . . . . . . . .
Removal procedure for Lenovo S14 G3 IAP and
Lenovo S14 G3 ABA . . . . . . . . . . . . .
Remove the lower case . . . . . . . . . .
Remove the battery pack . . . . . . . . .
Remove the solid-state drive (SSD) module . .
Remove the Wi-Fi card . . . . . . . . . .
Remove the CMOS battery . . . . . . . .
Remove the memory module . . . . . . . .
Remove the heat sink (for Lenovo S14 G3
IAP). . . . . . . . . . . . . . . . . .
© Copyright Lenovo 2022
. . . . . . . . . . .
Remove the heat sink (for Lenovo S14 G3
ABA) . . . . . . . . . . . . . . . . .
Remove the fan . . . . . . . . . . . . .
Remove the I/O board module . . . . . . .
Remove the fingerprint board module . . . .
Remove the system board and the touchpad
board cable . . . . . . . . . . . . . .
Remove the LCD unit . . . . . . . . . . .
Remove the upper case . . . . . . . . . .
Disassemble the LCD unit . . . . . . . . .
Removal procedure for Lenovo S15 G3 IAP and
Lenovo S15 G3 ABA . . . . . . . . . . . . .
21 Remove the lower case . . . . . . . . . .
22
Remove the battery pack . . . . . . . . .
Remove the solid-state drive (SSD) module . .
Remove the Wi-Fi card . . . . . . . . . .
Remove the CMOS battery . . . . . . . .
23
Remove the memory module . . . . . . . .
Remove the heat sink (for Lenovo S15 G3
IAP). . . . . . . . . . . . . . . . . .
Remove the heat sink (for Lenovo S15 G3
33
ABA) . . . . . . . . . . . . . . . . .
33
Remove the fan . . . . . . . . . . . . .
Remove the I/O board module . . . . . . .
34
Remove the fingerprint board module . . . .
34
Remove the system board and the touchpad
35
board cable . . . . . . . . . . . . . .
36
Remove the LCD unit . . . . . . . . . . .
37
Remove the upper case . . . . . . . . . .
38
Disassemble the LCD unit . . . . . . . . .
39
Appendix A. Label locations. . . . . . 77
41
Trademarks . . . . . . . . . . . . . . . . lxxix
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