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Installing and connecting the device
3.1 Preparing for installation
7. Please keep the enclosed documentation in a safe place. It belongs to the device. You
need the documentation when you commission the device for the first time.
8. Write down the identification data of the device.
3.1.2
Built-in unit
3.1.2.1
Permitted mounting positions
The device is suitable for installation in:
● Mounting cabinets
● Control cabinets
● Switchboards
● Consoles
In the following, all of these mounting options are referred to by the general term "cabinet".
The device is self-ventilated and approved for inclined mounting at angles up to +/-35° from
the vertical.
NOTICE
Damage due to overheating
Inclined installation reduces the convection by the device and therefore the maximum
permitted ambient temperature for operation.
The ambient temperature ranges listed in this section apply to the rear and the front of the
HMI device.
For information on permitted ambient temperatures, refer to the section
Technical specifications (Page 109).
38
NOTICE
Damage from condensation
If the device is subjected to low temperatures or extreme fluctuations in temperature
during transportation, as is the case in cold weather, for example, moisture can build up
on or inside the device (condensation).
Moisture causes a short circuit in electrical circuits and damages the device.
In order to prevent damage to the device, proceed as follows:
• Store the device in a dry place.
• Bring the device to room temperature before starting it up.
• Do not expose the device to direct heat radiation from a heating device.
• If condensation develops, wait until the device is completely dry before switching it
on.
IFP, IFP PRO, IFP ETH
Operating Instructions, 09/2019, A5E31298376-AJ
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