Shipping And Storage - Texas Instruments TMS320C44 DSP Packaging Manual

Shipping and Storage

TI qualification testing has now been completed. This testing, which included
multiple dead drops of up to three feet, indicates that this packaging procedure
sufficiently protects and preserves original lead dress integrity. The testing re-
sults also reinforced our belief that such extraordinary packing procedures
should be maintained until the device is safely mounted.
The packing technique consists of an inner box inside an outer box, or box-in-
a-box packing methodology. See Figure 1.
Figure 1. Packing Technique — Top View
The devices are first packed in trays. A tray bundle is then formed and is placed
in a dry pack bag. The tray bundle (inside of a dry pack bag) is then placed
inside an inner (JEDEC) box (this practice is common to MOS-integrated
circuits within the industry as well as at TI). The inner (JEDEC) box is then
placed into an outer box surrounded by foam packing material. For the
TMS320C44PDB, this cushioning provides shock absorption if the outer box
is accidentally dropped during shipping or is otherwise jostled in handling.
Inner box
Shipping and Storage
Outer box
Bubble wrap
Packaging Instructions 3