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1.3 Requirements for storage and baking after opening the antihumidity packaging (dry bag)
A
After a dry pack has been opened, all SMD packages within that bag must complete all solder reflow processing, including
rework, within 168 hours (1 week), unless opened parts are stored in a dry cabinet at <10% RH. After this time, parts must
be baked as per the below conditions before use.
Heatproof trays (you will see clear "Heat Proof Tray" markings) are employed for some products. If the term of viability after
opening the antihumidity packaging elapses during your manufacturing span, be sure to apply a baking process to the
products with the heatproof tray before mounting the products.
The recommended baking conditions are as follows:
at 125 degrees C for 24 hours
1.4 Analysis of nonconforming items
B
When you remove our semiconductor products to analyze a nonconforming item, it is recommended to remove them after
baking under the conditions mentioned in 1.3 above. If you remove the product using hot air in a status where the resin has
absorbed moisture, heat stress may cause package cracking or adhesion degradation of the resin, and the actual reason for
nonconformity may not found easily.
C
D
E
F
60
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DBR-TF100
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