DIGITAL-LOGIC SmartModule Express SMX945 User Manual page 14

DIGITAL-LOGIC AG
Physical Characteristics
Dimensions
Weight
PCB Thickness
PCB Layer
Operating Environment
Relative Humidity
Vibration
Shock
Operating Temperature
Maximum Copper Temperature
Storage Temperature
EMI / EMC (IEC1131-2 refer MIL
461/462)
ESD Electro Static Discharge
REF Radiated Electromagnetic Field
EFT Electric Fast Transient (Burst)
SIR Surge Immunity Requirements
High-Frequency Radiation
All information is subject to change without notice.
Specification
Length: 117 mm +/- 0.1mm
Depth: 70 mm +/- 0.1mm
Height: 15 mm +/- 0.2mm (with 5mm bus connectors)
18 mm +/- 0.2mm (with 8mm bus connectors)
The connector height is selected by the connector on the carrier board.
120 gr / 12 ounces
1.6 mm / 0.0625 inches nominal
Multilayer
Specification
5-90% non-condensing
5 to 2000 Hz
10 G
Standard: T.B.D. (depends on the CPU and the cooling concept)
Extended Range: T.B.D.
90° C
-55° C to +85°C
Specification
IEC 801-2, EN55101-2, VDE 0843/0847 Part 2
Metallic protection needed
Separate Ground Layer included
15 kV single peak
IEC 801-3, VDE 0843 Part 3, IEC770 6.2.9.
Not tested
IEC 801-4, EN50082-1, VDE 0843 Part 4
250V - 4kV, 50 ohms, Ts=5ns
Grade 2: 1KV Supply, 500 I/O, 5Khz
IEC 801-5, IEEE587, VDE 0843 Part 5
Supply: 2kV, 6 pulse/minute
I/O: 500V, 2 pulse/minute
FD, CRT: None
EN55022
14
SMX945 Condensed Manual V1.0A