XENSIV™ BGT60LTR11AIP Radar Shield2Go
Super low-power 60 GHz Doppler radar sensor with antennas-in-package
Introduction
Table of contents
About this document ....................................................................................................................... 1
Table of contents ............................................................................................................................ 2
1
Introduction .......................................................................................................................... 3
1.1
Overview .................................................................................................................................................. 3
1.1.1
1.1.2
Quad-state input pins ........................................................................................................................ 3
1.1.3
SPI communication ............................................................................................................................ 4
1.2
Key features ............................................................................................................................................. 4
1.3
Potential applications ............................................................................................................................. 4
2
2.1
Board dimensions ................................................................................................................................... 6
3
Getting started ...................................................................................................................... 7
3.1
Overview .................................................................................................................................................. 7
3.2
Hardware setup ....................................................................................................................................... 7
3.3
Software setup ...................................................................................................................................... 10
3.3.1
3.3.2
3.3.3
3.3.3.1
Prework for SEGGER J-Link ........................................................................................................ 10
3.3.3.2
4
Radar modes setup ................................................................................................................ 15
4.1
TD and PD signals .................................................................................................................................. 15
4.2
4.2.1
"Advance mode" .............................................................................................................................. 15
4.2.2
4.2.3
QS1 - MMIC operation modes .......................................................................................................... 17
4.2.4
QS2 - detector threshold ................................................................................................................. 17
4.2.5
QS3 - detector hold time ................................................................................................................. 18
4.2.6
QS4 - operating frequency .............................................................................................................. 20
5
Hardware circuits .................................................................................................................. 21
5.1
Power supply ......................................................................................................................................... 21
5.2
Level shifters .......................................................................................................................................... 21
5.3
LEDs ....................................................................................................................................................... 22
5.1
Crystal oscillator .................................................................................................................................... 23
5.2
External capacitors ................................................................................................................................ 24
6
PCB design ........................................................................................................................... 26
6.1
Layer stack-up and routing ................................................................................................................... 26
6.2
Bill of materials ...................................................................................................................................... 26
6.3
Schematics ............................................................................................................................................ 27
7
References ........................................................................................................................... 30
Revision history............................................................................................................................. 31
Application Note
page 2 of 32
V1.0
2022-12-15