Pcb Design; Layer Stack-Up And Routing; Bill Of Materials - Infineon XENSIV BGT60LTR11AIP Manual

XENSIV™ BGT60LTR11AIP Radar Shield2Go
Super low-power 60 GHz Doppler radar sensor with antennas-in-package

PCB design

6 PCB design
6.1

Layer stack-up and routing

Figure 22 Layer stack-up of the BGT60LTR11AIP Radar Shield2Go
The PCB is designed with a four-layer stack-up with standard FR4 material. Figure 22 shows the different layers
and their thicknesses. In the routing on the PCB, the VTUNE pin on the BGT60LTR11AIP MMIC should be left
floating. Any components added to the line, or a long wire connected can result in spurs.
The MMIC is very sensitive to noises and electrical influences; therefore, the GND and PWR layers were
separated from the signal layers (top and bottom). Additionally, to guarantee best performance of the radar, an
elliptical space of 4 to 5 cm around the MMIC was kept free from any PCB components (except the power
capacitors).
6.2

Bill of materials

Qty Designator
1 C4
1 C16
1 Direction
1 G1
1 LED1
1 Motion
1 PWR
1 R10
1 R23
1 R24
1 U1
1 Y1
2 C1, C3
Application Note
Package Package
metric imperial
1005 0402
1005 0402
1608 0603
Green Green
0402
1005 0402
1005 0402
BGA, 42
pins
1608 0603
page 26 of 32
Value
11 pF
16 pF
Red
TLS202A1MBV
Yellowish green
Blue
XZBGR155W5MAV
100 R
6.8 k
27 k
BGT60LTR11AiP
FH3840024Z
10 µF
Manufacturer order
number
GRM1535C1H110GDD5
GRM1535C1H160GDD5
LSM0603412V
TLS202A1MBV
SML-P12MTT86R
LSM0603463V
XZBGR155W5MAV
CRCW0402100RFK
CRCW04026K80FK
CRCW040227K0FK
BGT60LTR11AiP
FH3840024Z
GRM188R61E106MA73,
GRM188R61A106KE69
2022-12-15
V1.0