Siemens sinamics g120 Hardware Installation Manual page 49

Diagrams for grounding and high-frequency equipotential bonding measures
The following diagram illustrates all grounding and high-frequency equipotential bonding
measures using the example of a cabinet with a SINAMICS G120.
Grounding measures
①
High-frequency equipotential bonding measures
②
③
④
⑤
Figure 4-5
Power Module PM230, IP20 / Push-through technology (PT)
Hardware Installation Manual, 06/2014, A5E34331322B AA
Conventional grounding without any special HF properties
Electrically conductive connection to the mounting panel through the largest possible surface
HF equipotential bonding
Connect the shield through a large contact surface and ground
Connect the shield through an electrically conductive heavy-gauge threaded joint (gland) and
ground
Grounding and high-frequency equipotential bonding measures in the drive system and
in the plant
Connecting
4.2 EMC-compliant installation
49