Physical Description; Unpacking; Setting Up The Device - SIGNALCORE SC5312A User Manual

2 Physical Description

Unpacking

All SignalCore products ship in antistatic packaging (bags) to prevent damage from electrostatic discharge
(ESD). Under certain conditions, an ESD event can instantly and permanently damage several of the
components found in SignalCore products. Therefore, to avoid damage when handling any SignalCore
hardware, you must take the following precautions:
1. Ground yourself using a grounding strap or by touching a grounded metal object.
2. Touch the antistatic bag to a grounded metal object before removing the hardware from
its packaging.
3. NEVER touch exposed signal pins. Due to the inherent performance degradation caused
by ESD protection circuits in the RF path, the device has minimal ESD protection against
direct injection of ESD into the RF signal pins.
4. When not in use, store all SignalCore products in their original antistatic bags.
Remove the product from its packaging and inspect it for loose components or any signs of damage. Notify
SignalCore immediately if the product appears damaged in any way.

Setting Up the Device

Integration of the SC5312A and SC5313A modules requires attention to maintain effective cooling.
Inadequate cooling can cause the temperature inside the RF housing to rise above the maximum for this
product, leading to improper performance, reduction of product lifespan or complete product failure.
SignalCore suggests providing either moderate airflow across the RF housing, or if active cooling is not an
option, using thermal interface materials to bond the RF housing to a larger heatsinking surface (i.e. a
system enclosure). As each system configuration into which the device is integrated is unique, detailed
cooling options cannot be provided.
A cooling plan is sufficient when the SC5312A and SC5313A on-board temperature sensors indicate a rise
of no more than 20°C above ambient temperature under normal operating conditions.
©2013
Physical Description 7
Rev 2.1