CONTENTS
DIMENSION .............................................................................10
DISASSEMBLY ........................................................................12
2. MAIN PCB .........................................................................14
3. SMPS PCB ........................................................................14
4. WIFI MODULE ...................................................................15
SPECIAL MODE ......................................................................16
3. Version check .....................................................................18
4. Product Mode 1 ..................................................................19
5. Product Mode 2 ..................................................................19
BLOCK DIAGRAM ...................................................................36
POWER DIAGRAM ..................................................................37
WIRING DIAGRAM ..................................................................38
MAIN ......................................................................................42
NETWORK ..............................................................................43
AUDIO .....................................................................................44
FRONT ....................................................................................45
SMPS ......................................................................................46
EXPLODED VIEW ...................................................................47
PACKING VIEW .......................................................................48
SEMICONDUCTORS ...............................................................49
1. IC's .....................................................................................49
2. DISPLAY ............................................................................55
2