Quectel FC800L Manual page 9

Wi-Fi&Bluetooth Module Series
Figure Index
Figure 2: Pin Assignment (Top View) ...................................................................................................... 19
Figure 3: Power up Timing ...................................................................................................................... 23
Figure 4: WLAN Application Interface Connection .................................................................................. 23
Figure 5: SDIO Interface Connection ...................................................................................................... 25
Figure 6: Block Diagram of Bluetooth Application Interface Connection ................................................. 26
Figure 7: Reference Design for UART Interface Connection ................................................................... 27
Figure 8: PCM Interface Connection ....................................................................................................... 28
Figure 9: Reference Circuit for RF Antenna Interfaces ............................................................................ 31
Figure 10: Microstrip Design on a 2-layer PCB ....................................................................................... 32
Figure 11: Coplanar Waveguide Design on a 2-layer PCB ..................................................................... 32
Figure 12: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground) ................... 32
Figure 13: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground) ................... 33
Figure 14: Dimensions of the U.FL-R-SMT Connector (Unit: mm) .......................................................... 34
Figure 15: Mechanicals of UF.L-LP Connectors (Unit: mm) .................................................................... 35
Figure 16: Space Factor of Mated Connector (Unit: mm) ........................................................................ 35
Figure 17: Top and Side Dimensions (Top and Side View) ..................................................................... 44
Figure 18: Recommended Footprint (Top View)...................................................................................... 45
Figure 19: Top and Bottom Views of the Module ..................................................................................... 46
Figure 20: Recommended Reflow Soldering Thermal Profile .................................................................. 48
Figure 21: Carrier Tape Dimension Drawing ........................................................................................... 50
Figure 22: Plastic Reel Dimension Drawing ............................................................................................ 51
Figure 23: Packaging Process................................................................................................................. 52
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