Numark Mixstream Pro Service Manual page 48

1
A
B
C
EMC OPTION
C234 0.1uF
50V
C235 0.1uF
50V
GND GND_AMP
D
1
2
+VSYS +VSYS
C117 C118
470uF 470uF
25V 25V
1Kohm
GND_AMP GND_AMP
+3.3V L12
U17
18mA
15
PVDD
16
PVDD
27
PVDD
28
PVDD
2
DVDD
GND_AMP
C132 1uF 13
+3.3V AVDD
25V
C134 1uF 4
VR_DIG
25V
GND_AMP
10
AMP_I2C_SDA SDA
11
AMP_I2C_SCL SCL
3
AMP_nFAULT ADR/nFAULT
12
AMP_nPDN nPDN
R128 0.00 0.00 6
LRCK_AMP LRCLK
R129 0.00 0.00 7
BCLK_AMP SCLK
R130 0.00 0.00 8
I2S_AMP SDIN
TAS5805M
C139 1,000pF
16V
GND GND_AMP
PLACE CLOSE TO BCLK and SDOUTx TRACES
PASSING FROM GND TO GND_AMP PLANE
GND
2
3 4
L10
10uH
GND_AMP
L11
10uH
26
OUT_A+
23 GND_AMP
OUT_A-
L13
17
OUT_B+
20
10uH
OUT_B-
25 C131 0.22uF
BST_A+
25V
22 C133 0.22uF
BST_A-
25V
18 C135 0.22uF GND_AMP
BST_B+
25V
L14
21 C136 0.22uF
BST_B-
25V
10uH
TP1
9
SDOUT
TP
24
PGND
19 GND_AMP
PGND
14
AGND
5
DGND
1
DGND
29
PAD
GND_AMP
3 4
5
J15
TP20 1
Right+
TP21 2
Right-
TO SPEAKERS
twisted
J16
TP22 1
Left+
TP23 2
Left-
SIL SHROUDED 2.0mm
Layout Notes
12.1.3.1 Device, Copper, and Component Layout
Primarily, the goal of the PCB design is to minimize the thermal impedance in the path to those cooler structures. These tips should be
followed to achieve that goal:
• Avoid placing other heat producing components or structures near the amplifier (including above or below in the end equipment).
• If possible, use a higher layer count PCB to provide more heat sinking capability for the TAS5805M device and to prevent traces and
copper signal and power planes from breaking up the contiguous copper on the top and bottom layer.
• Place the TAS5805M device away from the edge of the PCB when possible to ensure that the heat can travel away from the device on
all four sides.
• Avoid cutting off the flow of heat from the TAS5805M device to the surrounding areas with traces or via strings. Instead, route traces
perpendicular to the device and line up vias in columns which are perpendicular to the device.
• Unless the area between two pads of a passive component is large enough to allow copper to flow in between the two pads, orient it so
that the narrow end of the passive component is facing the TAS5805M device.
• Because the ground pins are the best conductors of heat in the package, maintain a contiguous ground plane from the ground pins to the
PCB area surrounding the device for as many of the ground pins as possible.
Copyright 2021, inMusic Brands
All Rights Reserved
Originally Drawn By:
Last Modified By: 200 Scenic View Dr.
Last Modified: 3/18/2021 Cumberland, RI 02864
5
6
A
B
C
D
Project: INM-PCB-NH08-RearPanel.PrjPcb Rev J
Sheet: AMP.SchDoc
Variant: Default Sheet: 7 of 7
6