Sony HCD-GT3D Service Manual page 81

Ref. No. Part No. Description
A-2061-348-A DAMP BOARD, COMPLETE
*********************
< CAPACITOR >
C1001 1-118-347-11 CERAMIC CHIP 0.1uF
C1002 1-118-347-11 CERAMIC CHIP 0.1uF
C1003 1-116-716-11 CERAMIC CHIP 10uF
C1004 1-128-991-21 ELECT CHIP
* C1005 1-116-714-11 CERAMIC CHIP 22uF
C1007 1-162-960-11 CERAMIC CHIP 220PF
C1008 1-112-692-11 CERAMIC CHIP 1000PF
C1011 1-112-692-11 CERAMIC CHIP 1000PF
C1012 1-118-386-11 CERAMIC CHIP 0.1uF
C1015 1-118-386-11 CERAMIC CHIP 0.1uF
C1020 1-118-386-11 CERAMIC CHIP 0.1uF
* C1021 1-118-360-11 CERAMIC CHIP 0.1uF
C1022 1-116-782-91 CERAMIC CHIP 2.2uF
C1026 1-116-782-91 CERAMIC CHIP 2.2uF
C1029 1-116-782-91 CERAMIC CHIP 2.2uF
C1036 1-116-782-91 CERAMIC CHIP 2.2uF
C1037 1-118-386-11 CERAMIC CHIP 0.1uF
C1038 1-118-386-11 CERAMIC CHIP 0.1uF
C1039 1-164-934-11 CERAMIC CHIP 330PF
C1040 1-118-289-11 CERAMIC CHIP 0.1uF
C1043 1-162-966-91 CERAMIC CHIP 0.0022uF
C1044 1-162-966-91 CERAMIC CHIP 0.0022uF
C1045 1-118-369-11 CERAMIC CHIP 0.022uF
C1046 1-118-369-11 CERAMIC CHIP 0.022uF
C1047 1-162-966-91 CERAMIC CHIP 0.0022uF
C1048 1-162-966-91 CERAMIC CHIP 0.0022uF
C1049 1-118-369-11 CERAMIC CHIP 0.022uF
C1050 1-118-369-11 CERAMIC CHIP 0.022uF
C1051 1-162-966-91 CERAMIC CHIP 0.0022uF
C1052 1-162-966-91 CERAMIC CHIP 0.0022uF
C1053 1-118-369-11 CERAMIC CHIP 0.022uF
C1054 1-118-369-11 CERAMIC CHIP 0.022uF
C1055 1-162-966-91 CERAMIC CHIP 0.0022uF
C1056 1-162-966-91 CERAMIC CHIP 0.0022uF
C1057 1-118-369-11 CERAMIC CHIP 0.022uF
C1058 1-118-369-11 CERAMIC CHIP 0.022uF
C1059 1-116-405-11 CERAMIC CHIP 0.01uF
* C1060 1-118-360-11 CERAMIC CHIP 0.1uF
* C1061 1-118-360-11 CERAMIC CHIP 0.1uF
C1062 1-116-708-11 CERAMIC CHIP 47uF
C1063 1-116-708-11 CERAMIC CHIP 47uF
C1067 1-114-831-91 CERAMIC CHIP 1uF
C1068 1-114-831-91 CERAMIC CHIP 1uF
C1074 1-116-911-21 CERAMIC CHIP 1uF
C1075 1-116-911-21 CERAMIC CHIP 1uF
C1076 1-118-066-11 CERAMIC CHIP 0.1uF
C1077 1-116-405-11 CERAMIC CHIP 0.01uF
C1078 1-116-405-11 CERAMIC CHIP 0.01uF
C1079 1-118-066-11 CERAMIC CHIP 0.1uF
C1080 1-118-066-11 CERAMIC CHIP 0.1uF
C1081 1-116-405-11 CERAMIC CHIP 0.01uF
C1082 1-118-066-11 CERAMIC CHIP 0.1uF
C1083 1-128-403-11 ELECT CHIP
C1089 1-128-991-21 ELECT CHIP
* C1090 1-118-360-11 CERAMIC CHIP 0.1uF
C1091 1-128-991-21 ELECT CHIP
Note 1: When the complete DAMP board is replaced, re-
fer to "NOTE OF REPLACING THE IC1001 ON
THE DAMP BOARD AND THE COMPLETE DAMP
BOARD" on servicing notes (page 5).
Remark
* C1095
10% 25V
10% 25V
10% 16V
10uF 20% 50V
20% 6.3V
10% 50V
5% 50V
5% 50V
10% 16V
10% 16V
10% 16V
10% 25V
10% 100V
10% 100V
10% 100V
10% 100V
10% 16V * C1131
10% 16V
10% 50V * C1133
10% 16V
10% 50V
10% 50V
10% 50V
10% 50V
10% 50V
10% 50V
10% 50V
10% 50V
10% 50V
10% 50V
10% 50V
10% 50V * C1149
10% 50V
10% 50V
10% 50V
10% 50V
10% 100V
10% 25V
10% 25V
20% 6.3V
20% 6.3V
10% 100V
10% 100V
10% 250V
10% 250V
10% 100V
10% 100V
10% 100V
10% 100V
10% 100V
10% 100V
10% 100V
47uF 20% 35V
10uF 20% 50V
10% 25V
10uF 20% 50V
Note 2: When the C1126, C1127, C1128, C1129 and C1142 on the
Ref. No. Part No. Description
C1092 1-112-692-11 CERAMIC CHIP 1000PF
1-118-360-11 CERAMIC CHIP 0.1uF
C1104 1-162-966-91 CERAMIC CHIP 0.0022uF
C1105 1-162-966-91 CERAMIC CHIP 0.0022uF
C1106 1-162-966-91 CERAMIC CHIP 0.0022uF
C1107 1-162-966-91 CERAMIC CHIP 0.0022uF
C1108 1-126-193-11 ELECT CHIP
C1117 1-165-908-11 CERAMIC CHIP 1uF
C1118 1-165-908-11 CERAMIC CHIP 1uF
C1119 1-165-908-11 CERAMIC CHIP 1uF
C1120 1-165-908-11 CERAMIC CHIP 1uF
C1121 1-118-066-11 CERAMIC CHIP 0.1uF
C1122 1-118-066-11 CERAMIC CHIP 0.1uF
C1123 1-116-405-11 CERAMIC CHIP 0.01uF
C1124 1-116-405-11 CERAMIC CHIP 0.01uF
C1125 1-116-708-11 CERAMIC CHIP 47uF
C1126 1-112-247-31 ELECT
C1127 1-112-247-31 ELECT
C1128 1-112-247-31 ELECT
C1129 1-112-247-31 ELECT
1-118-360-11 CERAMIC CHIP 0.1uF
C1132 1-118-371-11 CERAMIC CHIP 0.015uF
1-118-360-11 CERAMIC CHIP 0.1uF
C1134 1-118-361-11 CERAMIC CHIP 0.1uF
C1136 1-137-765-21 ELECT CHIP
C1137 1-165-492-21 ELECT CHIP
C1138 1-118-066-11 CERAMIC CHIP 0.1uF
C1139 1-118-066-11 CERAMIC CHIP 0.1uF
C1140 1-118-066-11 CERAMIC CHIP 0.1uF
C1141 1-118-066-11 CERAMIC CHIP 0.1uF
C1142 1-118-933-11 ELECT (BLOCK) 3300uF
C1143 1-118-289-11 CERAMIC CHIP 0.1uF
C1144 1-165-492-21 ELECT CHIP
C1147 1-112-514-91 CERAMIC CHIP 1500PF
C1148 1-118-381-11 CERAMIC CHIP 0.0022uF
1-118-035-11 CERAMIC CHIP 0.1uF
C1150 1-112-514-91 CERAMIC CHIP 1500PF
C1151 1-118-381-11 CERAMIC CHIP 0.0022uF
C1155 1-162-966-91 CERAMIC CHIP 0.0022uF
C1156 1-114-588-91 CERAMIC CHIP 0.0027uF
C1167 1-118-066-11 CERAMIC CHIP 0.1uF
C1168 1-118-066-11 CERAMIC CHIP 0.1uF
C1169 1-118-066-11 CERAMIC CHIP 0.1uF
< CONNECTOR >
CN1001 1-820-117-51 CONNECTOR, FFC/FPC 19P
CN1004 1-770-469-21 PIN, CONNECTOR (PC BOARD) 2P
CN1005 1-691-770-11 PLUG (MICRO CONNECTOR) 8P
CN1007 1-564-320-00 PIN, CONNECTOR (3.96mm PITCH) 2P
< DIODE >
D1001 6-500-400-01 DIODE BAV99-215
D1002 6-500-400-01 DIODE BAV99-215
D1005 6-500-400-01 DIODE BAV99-215
D1006 6-500-400-01 DIODE BAV99-215
D1007 8-719-073-35 DIODE RB551V-30TE-17
D1008 6-500-400-01 DIODE BAV99-215
D1013 6-502-961-01 DI DA2J10100L
D1014 6-502-970-01 DI DZ2J068M0L
D1016 6-503-987-01 DI RF05VAM2STR
D1017 8-719-073-35 DIODE RB551V-30TE-17
DAMP board are replaced, spread the bond referring to "BOND
FIXATION OF ELECTRIC PARTS" on servicing notes (page 6).
HCD-GT3D
Ver. 1.1
DAMP
Remark
5% 50V
10% 25V
10% 50V
10% 50V
10% 50V
10% 50V
1uF 20% 50V
10% 10V
10% 10V
10% 10V
10% 10V
10% 100V
10% 100V
10% 100V
10% 100V
20% 6.3V
220uF 20% 35V
220uF 20% 35V
220uF 20% 35V
220uF 20% 35V
10% 25V
10% 50V
10% 25V
10% 50V
47uF 20% 16V
100uF 20% 10V
10% 100V
10% 100V
10% 100V
10% 100V
20% 71V
10% 16V
100uF 20% 10V
5% 50V
10% 50V
10% 25V
5% 50V
10% 50V
10% 50V
5% 50V
10% 100V
10% 100V
10% 100V
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