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User's Guide
TPS274C65 Evaluation Module
The TPS274C65EVM is a hardware evaluation module (EVM) used to enable hardware engineers to evaluate
the full performance and functionality of the TPS274C65 industrial high side switch. The TPS274C65EVM
contains everything needed to test and assess the TPS274C65 before designing it into part of a greater
application's power system. The TPS274C65EVM is compatible with AS and BS version of TPS274C65. To
use the SPI interface of TPS274C65AS and TPS274C65BS correctly, the evaluation module is designed to
either use external microcontroller with jumper wires or in conjunction with an underlying Texas Instruments
microcontroller by using the standardized BoosterPack
SPI communication, adjustable current limiting, and various protection and diagnostics are enabled and visible
through use of this evaluation module.
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Introduction.............................................................................................................................................................................2
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Operation.......................................................................................................................................................
4 TPS274C65EVM Schematic...................................................................................................................................................
5 Connection Descriptions.......................................................................................................................................................
Materials......................................................................................................................................................................11
Figure 6-1. 3D Representation....................................................................................................................................................
Layer...................................................................................................................................................................8
Figure 6-3. Ground Layer............................................................................................................................................................
Figure 6-4. Power Layer..............................................................................................................................................................
Figure 6-5. Bottom Layer...........................................................................................................................................................
Table 2-1. Device Comparison Table...........................................................................................................................................
Configurations................................................................................................................................................6
Trademarks
BoosterPack
™
is a trademark of Texas Instruments.
All trademarks are the property of their respective owners.
SLVUCI0 - MAY 2022
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ABSTRACT
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Table of Contents
List of Figures
List of Tables
Versions.............................................................................................................3
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Copyright © 2022 Texas Instruments Incorporated
headers. A wide range of application features such as
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