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User's Guide
High Side Switch Motherboard Evaluation Module
The HSS-MOTHERBOARDEVM evaluation module is designed to evaluate the < 50-mΩ Ron devices in TI's
high side switch portfolio. These devices include TPS27SA08, TPS1HA08-Q1, TPS2HB08-Q1, TPS2HB16-Q1,
TPS2HB35-Q1, and TPS2HB50-Q1. This board does not come with the devices populated but allows any of the
devices to be soldered down on the sample daughter card and used in the main motherboard. This user's guide
provides the connectors and test point description, schematic, bill of materials (BOM), and board layout of the
EVM.
This EVM does NOT come with devices populated on the board. The user MUST order samples
separately.
1
Introduction.............................................................................................................................................................................2
1.1 Descriptions.......................................................................................................................................................................
1.2
Applications........................................................................................................................................................................2
1.3 Features.............................................................................................................................................................................
3 Connections Descriptions.....................................................................................................................................................
3.1 Connectors and Test Points...............................................................................................................................................
3.2
Jumpers..............................................................................................................................................................................8
Limit..........................................................................................................................................................................11
Sense........................................................................................................................................................................11
7 Transient Protection.............................................................................................................................................................
8 Soldering Down U2...............................................................................................................................................................
Materials......................................................................................................................................................................11
History.......................................................................................................................................................................13
Figure 2-1. HSS-MOTHERBOARDEVM Motherboard Schematic..............................................................................................
Figure 2-2. HSS-MOTHERBOARDEVM Sample Daughter Card Schematic..............................................................................
Figure 4-2. HSS-MOTHERBOARDEVM Layout and Routing (Bottom View)............................................................................
Table 3-2. Jumper Descriptions...................................................................................................................................................
Trademarks
All trademarks are the property of their respective owners.
SLVUBD4B - JANUARY 2018 - REVISED OCTOBER 2020
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ABSTRACT
Table of Contents
Schematic..................................................................................................................................4
List of Figures
List of Tables
Descriptions.......................................................................................................................7
Copyright © 2020 Texas Instruments Incorporated
Note
Layout.....................................................................................9
View)....................................................................................9
High Side Switch Motherboard Evaluation Module
Table of Contents
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Summary of Contents for Texas Instruments HSS-MOTHERBOARDEVM
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Page 1: Table Of Contents
High Side Switch Motherboard Evaluation Module ABSTRACT The HSS-MOTHERBOARDEVM evaluation module is designed to evaluate the < 50-mΩ Ron devices in TI's high side switch portfolio. These devices include TPS27SA08, TPS1HA08-Q1, TPS2HB08-Q1, TPS2HB16-Q1, TPS2HB35-Q1, and TPS2HB50-Q1. This board does not come with the devices populated but allows any of the devices to be soldered down on the sample daughter card and used in the main motherboard. -
Page 2: Introduction
1 Introduction Texas Instruments' HSS-MOTHERBOARDEVM evaluation module has a central socket for the supporting daughtercard with the high side switch device to be populated. The EVM supports the entire single-channel and dual channel low Ron (≤ 50-mΩ) high-side driver applications. The purpose of this EVM is to facilitate evaluation of the low Ron high side switches for the diagnostic features and drive resistive, capacitive, and inductive loads. -
Page 3: Features
– Immediate shutdown or continuous clamping during fault current condition – Diagnostic enable function for multiplexing of MCU analog or digital port SLVUBD4B – JANUARY 2018 – REVISED OCTOBER 2020 High Side Switch Motherboard Evaluation Module Submit Document Feedback Copyright © 2020 Texas Instruments Incorporated... -
Page 4: Hss-Motherboardevm Schematic
HSS-MOTHERBOARDEVM Schematic www.ti.com 2 HSS-MOTHERBOARDEVM Schematic Figure 2-1 Figure 2-2 illustrate the HSS-MOTHERBOARDEVM motherboard and daughterboard schematics, respectively. High Side Switch Motherboard Evaluation Module SLVUBD4B – JANUARY 2018 – REVISED OCTOBER 2020 Submit Document Feedback Copyright © 2020 Texas Instruments Incorporated... -
Page 5: Figure 2-1. Hss-Motherboardevm Motherboard Schematic
S NS _IC S NS S ingle _Cha nne l TP S 2HB08BQP WP RQ1 Figure 2-1. HSS-MOTHERBOARDEVM Motherboard Schematic SLVUBD4B – JANUARY 2018 – REVISED OCTOBER 2020 High Side Switch Motherboard Evaluation Module Submit Document Feedback Copyright © 2020 Texas Instruments Incorporated... -
Page 6: Figure 2-2. Hss-Motherboardevm Sample Daughter Card Schematic
TP S 2HB16BQP WP RQ1 J13_S J14_S Vout1_3_C Vout2_3_C J15_S Figure 2-2. HSS-MOTHERBOARDEVM Sample Daughter Card Schematic High Side Switch Motherboard Evaluation Module SLVUBD4B – JANUARY 2018 – REVISED OCTOBER 2020 Submit Document Feedback Copyright © 2020 Texas Instruments Incorporated... -
Page 7: Connections Descriptions
5-V external input terminal for 5-V EVM. TP13, TP14, TP15, TP16 This is a direct connection to the GND plane of the EVM. SLVUBD4B – JANUARY 2018 – REVISED OCTOBER 2020 High Side Switch Motherboard Evaluation Module Submit Document Feedback Copyright © 2020 Texas Instruments Incorporated... -
Page 8: Jumpers
These jumpers connect the motherboard to the daughterboard. J17, J18, J19 Connect Vout1 to single channel. J20, J21, J22 Connect Vout2 to single channel. High Side Switch Motherboard Evaluation Module SLVUBD4B – JANUARY 2018 – REVISED OCTOBER 2020 Submit Document Feedback Copyright © 2020 Texas Instruments Incorporated... -
Page 9: Hss-Motherboardevm Evm Assembly Drawings And Layout
4 HSS-MOTHERBOARDEVM EVM Assembly Drawings and Layout Figure 4-1 show the design of the HSS-MOTHERBOARDEVM and daughterboard PCB. The EVM was designed using FR4 material on a two-layer board. All components are located in an active area on the top side and active traces are provided in the top and bottom layers to allow the user to easily view, probe, and evaluate. -
Page 10: Figure 4-2. Hss-Motherboardevm Layout And Routing (Bottom View)
HSS-MOTHERBOARDEVM EVM Assembly Drawings and Layout www.ti.com Figure 4-2. HSS-MOTHERBOARDEVM Layout and Routing (Bottom View) High Side Switch Motherboard Evaluation Module SLVUBD4B – JANUARY 2018 – REVISED OCTOBER 2020 Submit Document Feedback Copyright © 2020 Texas Instruments Incorporated... -
Page 11: Current Limit
7 Transient Protection The HSS-MOTHERBOARDEVM comes with large footprints for TVS diodes if they are needed for any transient testing. D3 is an SMB footprint while D4, D5, and D6 are SMC footprints. In addition, there are also some capacitor footprints that can be populated if need be such as C4 or C11. - Page 12 Q200 Grade 0, 0402 40-V, 8-mOhm Dual-Channel TPS2HB08DQPWP U1_S Smart High-Side Switch, PWP0024L Texas Instruments PWP0024L (TSSOP-24) High Side Switch Motherboard Evaluation Module SLVUBD4B – JANUARY 2018 – REVISED OCTOBER 2020 Submit Document Feedback Copyright © 2020 Texas Instruments Incorporated...
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Page 13: Revision History
Changes from Revision A (December 2018) to Revision B (October 2020) Page • Updated the numbering format for tables, figures and cross-references throughout the document....2 SLVUBD4B – JANUARY 2018 – REVISED OCTOBER 2020 High Side Switch Motherboard Evaluation Module Submit Document Feedback Copyright © 2020 Texas Instruments Incorporated... - Page 14 TI products. TI’s provision of these resources does not expand or otherwise alter TI’s applicable warranties or warranty disclaimers for TI products. TI objects to and rejects any additional or different terms you may have proposed. IMPORTANT NOTICE Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2022, Texas Instruments Incorporated...
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