HP 15-ew0 Series Maintenance And Service Manual page 61

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Before removing the heat sink, follow these steps:
1.
Prepare the computer for disassembly (see
2.
Remove the bottom cover (see
3.
Remove the battery (see
4.
Remove the solid-state drive (see
5.
Remove the fan (see
Remove the heat sink:
1.
In the order indicated on the heat sink, loosen the seven Phillips captive screws (1) that secure the heat sink
to the system board.
2.
Remove the heat sink from the system board (2).
3.
Thoroughly clean the thermal material from the surfaces of the heat sink and the system board
components each time the heat sink is removed. Replacement thermal material is included with the heat
sink and system board spare part kits. The following illustration shows the replacement thermal material
locations.
Thermal paste is used on the system board processor (1) and on the heat sink area (2) that services it.
Thermal paste is also used on the graphics subsystem controller (3) and on the heat sink area (4) that
services it.
Preparation for disassembly on page
Bottom cover on page
Battery on page
36).
Solid-state drive on page
System fan on page
43).
34).
37).
34).
Heat sink
55

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