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LMU-2x20™ Hardware and Installation Guide
3 Hardware Overview
3.1 Location Messaging Unit-2x30™ (LMU-2x30™)
3.1.1 LMU-2x30™ Handling Precautions
3.1.1.1 Electrostatic Discharge (ESD)
Electrostatic discharge (ESD) is the sudden and momentary electric current that flows
between two objects at different electrical potentials caused by direct contact or induced by
an electrostatic field. The term is usually used in the electronics and other industries to
describe momentary unwanted currents that may cause damage to electronic equipment.
3.1.1.2 ESD Handling Precautions
ESD prevention is based on establishing an Electrostatic Protective Area (EPA). The EPA
can be a small working station or a large manufacturing area. The main principle of an EPA
is that there are no highly charging materials in the vicinity of ESD sensitive electronics, all
conductive materials are grounded, workers are grounded, and charge build-up on ESD
sensitive electronics is prevented. International standards are used to define typical EPA and
can be obtained for example from International Electro-technical Commission (IEC) or
American National Standards Institute (ANSI).
This ESD classification of the sub assembly will be defined for the most sensitive
component, therefore the following classifications apply:
Class 1B – Human Model (< 1 Kv)
Class M1 – Machine Model (< 100V)
When handling the LMU-2x30's™ main-board (i.e. sub assembly) by itself or in a partial
housing proper ESD precautions should be taken. The handler should be in an ESD safe
area and be properly grounded.
3.1.1.3 GPS Ceramic Patch Handling
When handling the sub assembly it may be natural to pick it up by sides and make contact
with the antenna boards. In an uncontrolled ESD environment contact with the center pin
of ceramic patch antenna can create a path for electrostatic discharge directly to the GPS
Module. The GPS Module is very sensitive to ESD and can be damaged and rendered non-
functional at low levels of ESD.
One should avoid contact with the center pin of the patch during handling. Going forward
the Factory will be placing a protective layer of Kapton® tape over the patch element to
eliminate this ESD path.
V1.0.10
Copyright ©Calamp Wireless Networks Inc 2010
CalAmp Proprietary & Confidential
- 10 -
December 12, 2010
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