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bq50002EVM-607 Assembly Drawings and Layout
7
bq50002EVM-607 Assembly Drawings and Layout
Figure 8
through
Figure 11
a 4-layer, 2-oz, copper-clad circuit board, 13.2 cm × 7.24 cm with all components in a 4.0-cm x 5.0-cm
active area on the top side and all active traces on the top and bottom layers to allow the user to easily
view, probe, and evaluate bq50002 analog frontend IC and bq500511 control IC in a practical application.
Moving components to both sides of the PCB or using additional internal layers offers additional size
reduction for space-constrained systems. Gerber files are available for download from the EVM product
folder (bq50002EVM-607).
A 4-layer PCB design is recommended to provide a good low-noise ground plane for all circuits. A 2-layer
PCB presents a high risk of poor performance. Grounding between the bq50002 GND pins and filter
capacitor returns should be a good low-impedance path.
Coil Grounding – A ground plane area under the coil is recommended to reduce noise coupling into the
receiver. The ground plane for the EVM is slightly larger than the coil footprint and grounded at one point
back to the circuit area.
Note: The clear plastic cover thickness (0.93 in or 2.4 mm) is the z-gap thickness for the transmitter.
18
bq50002 Wireless Power TX EVM
show the design of the bq50002EVM PCB. The EVM has been designed using
Figure 8. Assembly Top
Copyright © 2015, Texas Instruments Incorporated
www.ti.com
SLVUAJ7 – October 2015
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