HP Pavilion DV6-3030 Maintenance And Service Manual page 91

Computer models equipped with a graphics subsystem with discrete memory have replacement thermal
material locations as shown in the following illustration:
●
Thermal paste is used on the processor (1) and the heat sink section (2) that services it
●
Thermal paste is used on the graphics subsystem chip (3) and the heat sink section (4) that
services it
●
A thermal pad is used on the system board PCH chip (5) and the heat sink section (6) that
services it
Replacement thermal material is included with all fan/heat sink assembly, system board, and processor
spare part kits.
NOTE: Computer models equipped with a graphics subsystem with UMA memory have replacement
thermal material locations as shown in the following illustration:
●
Thermal paste is used on the processor (1) and the heat sink section (2) that services it
●
A thermal pad is used on the system board PCH chip (3) and the heat sink section (4) that
services it
ENWW
Component replacement procedures
83